Inventor · disambiguated record
Yoshihisa Kawamoto
Also filed as: KAWAMOTO YOSHIHISA
7 granted patents·2 pending applications·331 citations·filing 1993–2021
89Inventor score
Files withTOWA CORP9
Top patents by PatentIndex Score
9 records- 0187US5834035AMethod of and apparatus for molding resin to seal electronic partsTOWA CORP·Filed 1996·Granted Nov 10, 1998·91 cites·13 claims
- 0285US5435953AMethod of molding resin for sealing an electronic deviceTOWA CORP·Filed 1993·Granted Jul 25, 1995·76 cites·12 claims
- 0378US6773247B1Die used for resin-sealing and molding an electronic componentTOWA CORP·Filed 2000·Granted Aug 10, 2004·31 cites·11 claims
- 0475US5753538AMethod of sealing electronic parts with molded resin and mold employed thereforTOWA CORP·Filed 1995·Granted May 19, 1998·42 cites·26 claims
- 0575US5603879AMethod of molding resin to seal electronic parts using two evacuation stepsTOWA CORP·Filed 1994·Granted Feb 18, 1997·48 cites·17 claims
- 0669US5507633AResin molding apparatus for sealing an electronic deviceTOWA CORP·Filed 1994·Granted Apr 16, 1996·36 cites·13 claims
- 0753US2023364833A1Method for manufacturing resin molded articleTOWA CORP·Filed 2021·Application pending·0 cites
- 0842US2023202079A1Resin molding apparatus, cover plate, and resin molded article production methodTOWA CORP·Filed 2021·Application pending·0 cites
- 0937US5750154AResin sealing/molding apparatus for electronic partsTOWA CORP·Filed 1996·Granted May 12, 1998·7 cites·8 claims
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