Inventor · disambiguated record
George A. Katopis
Also filed as: KATOPIS GEORGE · KATOPIS GEORGE A
13 granted patents·3 pending applications·217 citations·filing 1980–2012
92Inventor score
Top patents by PatentIndex Score
16 records- 0185US7465882B2Ceramic substrate grid structure for the creation of virtual coax arrangementIBM·Filed 2006·Granted Dec 16, 2008·10 cites·5 claims
- 0282US8295056B2Silicon carrier structure and method of forming sameANDRY PAUL STEPHEN·Filed 2009·Granted Oct 23, 2012·9 cites·15 claims
- 0380US8035409B2System and method implementing short-pulse propagation technique on production-level boards with incremental accuracy and productivity levelsIBM·Filed 2009·Granted Oct 11, 2011·11 cites·25 claims
- 0477US7936060B2Reworkable electronic device assembly and methodIBM·Filed 2009·Granted May 3, 2011·7 cites·12 claims
- 0577US5970052AMethod for dynamic bandwidth testingIBM·Filed 1997·Granted Oct 19, 1999·97 cites·13 claims
- 0671US7193318B2Multiple power density chip structureIBM·Filed 2004·Granted Mar 20, 2007·18 cites·13 claims
- 0768US7355125B2Printed circuit board and chip moduleIBM·Filed 2005·Granted Apr 8, 2008·4 cites·1 claims
- 0867US8227264B2Reworkable electronic device assembly and methodANDRY PAUL S·Filed 2011·Granted Jul 24, 2012·2 cites·8 claims
- 0966US4398106AOn-chip Delta-I noise clamping circuitIBM·Filed 1980·Granted Aug 9, 1983·19 cites·9 claims
- 1060US7985927B2Ceramic substrate grid structure for the creation of virtual coax arrangementIBM·Filed 2008·Granted Jul 26, 2011·1 cites·22 claims
- 1160US7897879B2Ceramic substrate grid structure for the creation of virtual coax arrangementIBM·Filed 2008·Granted Mar 1, 2011·1 cites·20 claims
- 1260US5477460AEarly high level net based analysis of simultaneous switchingIBM·Filed 1994·Granted Dec 19, 1995·37 cites·10 claims
- 1348US2012301977A1Silicon carrier structure and method of forming sameANDRY PAUL STEPHEN·Filed 2012·Application pending·0 cites
- 1444US7742315B2Circuit on a printed circuit boardIBM·Filed 2005·Granted Jun 22, 2010·1 cites·4 claims
- 1538US2005127500A1Local reduction of compliant thermally conductive material layer thickness on chipsIBM·Filed 2003·Application pending·0 cites
- 1636US2013024400A1Advanced modeling of printed circuit board costsIBM·Filed 2011·Application pending·0 cites
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