Inventor · disambiguated record
Chih-Yi Huang
Also filed as: HUANG CHIH-YI
20 granted patents·9 pending applications·23 citations·filing 2003–2025
90Inventor score
Files withADVANCED SEMICONDUCTOR ENG20CHENG HUNG-HSIANG4HUANG CHIH-YI2ORANGETEK CORP1QUANTA COMP INC1
Top patents by PatentIndex Score
29 records- 0193US11901245B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 0291US10886263B2Stacked semiconductor package assemblies including double sided redistribution layersADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 5, 2021·9 cites·20 claims
- 0389US2025372461A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0488US11699654B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jul 11, 2023·2 cites·20 claims
- 0582US12394676B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Aug 19, 2025·0 cites·10 claims
- 0682US10522508B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 31, 2019·4 cites·20 claims
- 0780US12216157B2Package structure and testing methodADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 0879US11733294B2Package structure and testing methodADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 22, 2023·1 cites·20 claims
- 0971US2025155498A1Package structure and testing methodADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1069US11424167B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 1163US9564393B1Semiconductor device package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Feb 7, 2017·1 cites·20 claims
- 1262US8193454B2Circuit substrate having power/ground plane with grid holesCHENG HUNG-HSIANG·Filed 2009·Granted Jun 5, 2012·3 cites·10 claims
- 1358US11714215B2Optical lens, mold for optical lens and manufacturing method thereofORANGETEK CORP·Filed 2020·Granted Aug 1, 2023·0 cites·19 claims
- 1458US7851895B2Semiconductor structure and semiconductor manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Dec 14, 2010·1 cites·20 claims
- 1554US10332849B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jun 25, 2019·0 cites·20 claims
- 1654US2024242542A1Gesture recognition deviceQUANTA COMP INC·Filed 2023·Application pending·0 cites
- 1753US11621220B2Assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 4, 2023·0 cites·17 claims
- 1852US7977784B2Semiconductor package having redistribution layerADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jul 12, 2011·0 cites·5 claims
- 1951US11515249B2Wiring package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 29, 2022·0 cites·15 claims
- 2050US11855034B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 26, 2023·0 cites·13 claims
- 2150US10074622B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 11, 2018·0 cites·20 claims
- 2245US7838777B2Signal transmission structure, package structure and bonding method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Nov 23, 2010·0 cites·8 claims
- 2344US2010065312A1Substrate for window ball grid array packageCHENG HUNG-HSIANG·Filed 2009·Application pending·0 cites
- 2444US2009019692A1Method of cutting signal wire preserved on circuit board and circuit layout thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 2543US2010071939A1Substrate of window ball grid array packageCHENG HUNG-HSIANG·Filed 2009·Application pending·0 cites
- 2641US8389394B2Method of making semiconductor package having redistribution layerHUANG CHIH-YI·Filed 2011·Granted Mar 5, 2013·0 cites·20 claims
- 2740US2010102447A1Substrate of window ball grid array package and method for making the sameHUANG CHIH-YI·Filed 2009·Application pending·0 cites
- 2839US2004075757A1Image retrieval system and method for processing image in image retrieval systemFiled 2003·Application pending·0 cites
- 2933US2010283139A1Semiconductor Device Package Having Chip With Conductive LayerCHENG HUNG-HSIANG·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →