Inventor · disambiguated record
Ryuya Mashiko
Also filed as: MASHIKO RYUYA
6 granted patents·5 pending applications·5 citations·filing 2017–2024
70Inventor score
Top patents by PatentIndex Score
11 records- 0182US11097544B2Liquid discharging head and liquid discharging apparatusMURAMATSU KOICHI·Filed 2019·Granted Aug 24, 2021·3 cites·18 claims
- 0276US11554376B2Container and calibration standard plateRICOH CO LTD·Filed 2017·Granted Jan 17, 2023·1 cites·18 claims
- 0368US10605716B2Particle counting apparatus, particle counting method, and particle containing sampleKATOH IKUO·Filed 2018·Granted Mar 31, 2020·1 cites·18 claims
- 0458US2021277347A1Cell culture vessel and cell chipNAKAYAMA TOMOAKI·Filed 2021·Application pending·0 cites
- 0557US11007774B2Droplet forming device, droplet forming method, and dispensing apparatusKURAMOCHI YUZURU·Filed 2019·Granted May 18, 2021·0 cites·15 claims
- 0656US2021277345A1Cell-containing container, method for evaluating test substance, and method for manufacturing cell-containing containerARATANI TOMOYUKI·Filed 2021·Application pending·0 cites
- 0755US2025007151A1Electromagnetic wave resonant structure, method for producing electromagnetic wave resonant structure, electronic component, and conductive structureMASHIKO RYUYA·Filed 2024·Application pending·0 cites
- 0854US11566273B2Method for producing cell contained base and method for evaluating equipmentRICOH CO LTD·Filed 2018·Granted Jan 31, 2023·0 cites·11 claims
- 0954US2025167160A1Adhesive structure and manufacturing method thereof, electronic component and manufacturing method thereof, and adhesive layer for transferYASHIRO TOHRU·Filed 2023·Application pending·0 cites
- 1054US2023307407A1Member, conductive layer, method for manufacturing member, and method for forming conductive layerYASHIRO TOHRU·Filed 2023·Application pending·0 cites
- 1153US10647111B2Liquid droplet forming device and liquid droplet forming methodKURAMOCHI YUZURU·Filed 2019·Granted May 12, 2020·0 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →