Inventor · disambiguated record
Tohru Nomura
Also filed as: NOMURA TOHRU
12 granted patents·131 citations·filing 1989–2014
90Inventor score
Top patents by PatentIndex Score
12 records- 0186US8207607B2Semiconductor device with resin moldYAMAGISHI TETSUTO·Filed 2008·Granted Jun 26, 2012·16 cites·16 claims
- 0271US5156903AMultilayer ceramic substrate and manufacture thereofSUMITOMO METAL CERAMICS INC·Filed 1990·Granted Oct 20, 1992·38 cites·8 claims
- 0367US8749055B2Semiconductor device with resin moldYAMAGISHI TETSUTO·Filed 2012·Granted Jun 10, 2014·2 cites·9 claims
- 0464US6499335B2Gas sensorFIGARO ENG·Filed 2000·Granted Dec 31, 2002·7 cites·6 claims
- 0561US5627344AMultilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrateSUMITOMO METAL CERAMICS INC·Filed 1994·Granted May 6, 1997·26 cites·6 claims
- 0655US6565812B1Gas sensor and method for producing itFIGARO ENG·Filed 2000·Granted May 20, 2003·8 cites·9 claims
- 0754US9087924B2Semiconductor device with resin moldDENSO CORP·Filed 2014·Granted Jul 21, 2015·0 cites·7 claims
- 0850US4994880ASemiconductor device constituting bipolar transistorNIPPON DENSO CO·Filed 1989·Granted Feb 19, 1991·13 cites·14 claims
- 0948US7675150B2Electric circuit device and related manufacturing methodDENSO CORP·Filed 2007·Granted Mar 9, 2010·0 cites·11 claims
- 1045US5729893AProcess for producing a multilayer ceramic circuit substrateSUMITOMO METAL SMI ELECTRONICS·Filed 1995·Granted Mar 24, 1998·12 cites·3 claims
- 1142US5709927AThick film circuit boardNIPPON DENSO CO·Filed 1996·Granted Jan 20, 1998·9 cites·14 claims
- 1236US7417318B2Thick film circuit board, method of producing the same and integrated circuit deviceDENSO CORP·Filed 2004·Granted Aug 26, 2008·0 cites·13 claims
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