Inventor · disambiguated record
Paul Hui
Also filed as: HUI PAUL · HUI PAUL T
7 granted patents·2 pending applications·92 citations·filing 2002–2009
86Inventor score
Files withFREESCALE SEMICONDUCTOR INC4GEN MOTORS OF CANADA LTD2GM GLOBAL TECH OPERATIONS INC1MOTOROLA INC1ROGGENBAUER TODD C1
Top patents by PatentIndex Score
9 records- 0178US8188543B2Electronic device including a conductive structure extending through a buried insulating layerROGGENBAUER TODD C·Filed 2006·Granted May 29, 2012·12 cites·11 claims
- 0276US6734524B1Electronic component and method of manufacturing sameMOTOROLA INC·Filed 2002·Granted May 11, 2004·21 cites·33 claims
- 0375US7615866B2Contact surrounded by passivation and polymide and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Nov 10, 2009·6 cites·5 claims
- 0470US7045189B2Molding for automotive applicationGEN MOTORS OF CANADA LTD·Filed 2003·Granted May 16, 2006·19 cites·12 claims
- 0569US7820519B2Process of forming an electronic device including a conductive structure extending through a buried insulating layerFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 26, 2010·5 cites·18 claims
- 0669US6930027B2Method of manufacturing a semiconductor componentFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 16, 2005·17 cites·27 claims
- 0760US6945592B1Sealer tape and clip assemblyGEN MOTORS OF CANADA LTD·Filed 2004·Granted Sep 20, 2005·12 cites·15 claims
- 0852US2010015793A1Contact surrounded by passivation and polymide and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 0948US2010196629A1Dimensionally stable moldingGM GLOBAL TECH OPERATIONS INC·Filed 2009·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →