Inventor · disambiguated record
Moritsugu Morita
Also filed as: MORITA MORITSUGU
6 granted patents·1 pending application·476 citations·filing 1986–2003
87Inventor score
Top patents by PatentIndex Score
7 records- 0194US5406124AInsulating adhesive tape, and lead frame and semiconductor device employing the tapeMITSUI TOATSU CHEMICALS·Filed 1993·Granted Apr 11, 1995·318 cites·16 claims
- 0292US4839232AFlexible laminate printed-circuit board and methods of making sameMITSUI TOATSU CHEMICALS·Filed 1986·Granted Jun 13, 1989·72 cites·14 claims
- 0371US7030170B2Photosensitive resin composition, dry film, and workpiece using the sameMITSUI CHEMICALS INC·Filed 2002·Granted Apr 18, 2006·12 cites·7 claims
- 0470US5990553AMetal-based semiconductor circuit substratesMITSUI CHEMICALS INC·Filed 1998·Granted Nov 23, 1999·43 cites·14 claims
- 0551US4788846AProcess for the correction of curls of flexible metal clad laminate and for the improvement of its dimensional stabilityMITSUI TOATSU CHEMICALS·Filed 1987·Granted Dec 6, 1988·22 cites·8 claims
- 0636US5089355AFlexible metal clad laminate, production method thereof and apparatus for the methodMITSUI TOATSU CHEMICALS·Filed 1988·Granted Feb 18, 1992·9 cites·16 claims
- 0731US2005165196A1Adhesive resin and film adhesive made by using the sameFiled 2003·Application pending·0 cites
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