Inventor · disambiguated record
Yoshikatsu Shiraokawa
Also filed as: SHIRAOKAWA YOSHIKATSU
3 granted patents·0 citations·filing 2016–2019
40Inventor score
Top patents by PatentIndex Score
3 records- 0163US12363826B2Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminateSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jul 15, 2025·0 cites·12 claims
- 0259US10940674B2Resin varnish, prepreg, laminate, and printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 9, 2021·0 cites·16 claims
- 0344US11136454B2Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2016·Granted Oct 5, 2021·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →