Inventor

CHEW YEN HSIANG

MY71 patents

⚠️ This page may combine multiple inventors who share the name “CHEW YEN HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEW YEN HSIANG

INTEL CORP

Integrated circuit structures with extended conductive pathways

Forming embedded circuit elements in semiconductor package assembles and structures formed thereby

Scalable and configurable queue management for network packet traffic quality of service

Stacked die package

Edge or fog gateway assisted IDE redirection for failover remote management applications

Queue management mechanism in network processor wherein packets stored at memory device corresponds to addresses stored in plurity of queues within queue management

Wearable electronic devices and components thereof

Wearable electronic devices and components thereof

Gateway assisted out-of-band keyboard, video, or mouse (KVM) for remote management applications

Cloud assisted machine learning

Edge or fog gateway assisted out-of-band remote management for managed client devices

Cloud-assisted perceptual computing analytics

Emulated MSI interrupt handling

Callback interrupt handling for multi-threaded applications in computing environments

Head pose determination using a camera and a distance determination

Flexible system-in-package solutions for wearable devices

Emulated message signaled interrupts in a virtualization environment

Techniques for video analytics of captured video content

Techniques for video analytics of captured video content

Techniques for video analytics of captured video content

Flexible packaging architecture

Configurable client hardware

Gateway assisted diagnostics and repair

Staggered die stacking across heterogeneous modules

Cloud assisted machine learning

Edge or fog gateway assisted out-of-band remote management for managed client devices

Heat removal between top and bottom die interface

Staggered die stacking across heterogeneous modules

Integrated circuit structures with extended conductive pathways

Multi-key graphic cryptography for encrypting file system acceleration

Interaction mode selection based on detected distance between user and machine interface

Bandwidth allocation for network packet traffic

CHEW YEN HSIANG

Method, apparatus and system for memory validation

Firmware verification using system memory error check logic

Performing emulated message signaled interrupt handling

Scalable memory protection mechanism

Determining, at least in part, one or more respective amounts of buffer memory

Accelerated cryptography with an encryption attribute

Method, system and apparatus for dynamic buffer management for power saving

Multi-key cryptography for encrypting file system acceleration

Network routing protocol power saving method for network elements

Method to emulate message signaled interrupts with interrupt data

Security for RAID systems

MOTOROLA SOLUTIONS INC

Video annotation

Automated form fill

Method for real-time talk-group creation within a push to talk for an Internet of Things system

PERIAMAN SHANGGAR

Die backside wire bond technology for single or stacked die package

Die backside metallization and surface activated bonding for stacked die packages

CHEAH BOK ENG

Stacked die package

PIXART IMAGING INC

Optical navigation device capable of determining shutter interval with mode transition and operating method thereof