Inventor · disambiguated record
Walter L. Moden
Also filed as: MODEN WALTER · MODEN WALTER L
199 granted patents·19 pending applications·9,405 citations·filing 1990–2025
99Inventor score
Files withMICRON TECHNOLOGY INC196MODEN WALTER L6ROUND ROCK RES LLC4KINSMAN LARRY D2CORISIS DAVID J1
Top patents by PatentIndex Score
218 records- 0199US6303981B1Semiconductor package having stacked dice and leadframes and method of fabricationMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 16, 2001·445 cites·23 claims
- 0299US6294839B1Apparatus and methods of packaging and testing dieMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 25, 2001·352 cites·16 claims
- 0399US6265766B1Flip chip adaptor package for bare dieMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 24, 2001·263 cites·114 claims
- 0499US6258623B1Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 10, 2001·354 cites·7 claims
- 0599US6225689B1Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2000·Granted May 1, 2001·295 cites·64 claims
- 0699US6072233AStackable ball grid array packageMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 6, 2000·579 cites·54 claims
- 0798US6310390B1BGA package and method of fabricationMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 30, 2001·318 cites·20 claims
- 0898US6297960B1Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·155 cites·34 claims
- 0998US6297548B1Stackable ceramic FBGA for high thermal applicationsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·259 cites·46 claims
- 1098US6291894B1Method and apparatus for a semiconductor package for vertical surface mountingMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 18, 2001·293 cites·5 claims
- 1198US5214845AMethod for producing high speed integrated circuitsMICRON TECHNOLOGY INC·Filed 1992·Granted Jun 1, 1993·407 cites·4 claims
- 1297US11996359B2Apparatuses including ball grid arrays and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted May 28, 2024·2 cites·20 claims
- 1397US7381591B2Flip-chip adaptor package for bare dieMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 3, 2008·46 cites·11 claims
- 1497US7329945B2Flip-chip adaptor package for bare dieMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 12, 2008·43 cites·3 claims
- 1596US8299598B2Grid array packages and assemblies including the sameMODEN WALTER L·Filed 2010·Granted Oct 30, 2012·32 cites·47 claims
- 1696US6709893B2Interconnections for a semiconductor device and method for forming sameMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 23, 2004·94 cites·25 claims
- 1796US6686655B2Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 3, 2004·45 cites·60 claims
- 1896US6486546B2Low profile multi-IC chip package connectorMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 26, 2002·47 cites·60 claims
- 1996US6049125ASemiconductor package with heat sink and method of fabricationMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 11, 2000·185 cites·36 claims
- 2096US6046496AChip packageMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 4, 2000·169 cites·35 claims
- 2196US5304842ADissimilar adhesive die attach for semiconductor devicesMICRON TECHNOLOGY INC·Filed 1992·Granted Apr 19, 1994·282 cites·20 claims
- 2296US5286679AMethod for attaching a semiconductor die to a leadframe using a patterned adhesive layerMICRON TECHNOLOGY INC·Filed 1993·Granted Feb 15, 1994·331 cites·22 claims
- 2396US5140404ASemiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tapeMICRON TECHNOLOGY INC·Filed 1991·Granted Aug 18, 1992·208 cites·15 claims
- 2495US11670578B2Ball grid arrays and associated apparatuses and systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 6, 2023·2 cites·24 claims
- 2595US6760224B2Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 6, 2004·60 cites·19 claims
- 2695US6563217B2Module assembly for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2002·Granted May 13, 2003·76 cites·26 claims
- 2795US6512303B2Flip chip adaptor package for bare dieMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 28, 2003·86 cites·114 claims
- 2895US6326242B1Semiconductor package with heat sink and method of fabricationMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 4, 2001·157 cites·34 claims
- 2995US6268649B1Stackable ball grid array packageMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 31, 2001·73 cites·51 claims
- 3094US6667556B2Flip chip adaptor package for bare dieMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 23, 2003·66 cites·112 claims
- 3194US6414374B2Semiconductor device including edge bond pads and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 2, 2002·62 cites·18 claims
- 3294US6329222B1Interconnect for packaging semiconductor dice and fabricating BGA packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 11, 2001·144 cites·23 claims
- 3394US6310288B1Underfill coating for loc packageMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 30, 2001·71 cites·8 claims
- 3494US6232666B1Interconnect for packaging semiconductor dice and fabricating BGA packagesMCIRON TECHNOLOGY INC·Filed 1998·Granted May 15, 2001·202 cites·30 claims
- 3594US6201304B1Flip chip adaptor package for bare dieMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 13, 2001·118 cites·12 claims
- 3694US6066514AAdhesion enhanced semiconductor die for mold compound packagingMICRON TECHNOLOGY INC·Filed 1997·Granted May 23, 2000·113 cites·18 claims
- 3794US5995378ASemiconductor device socket, assembly and methodsMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 30, 1999·57 cites·42 claims
- 3893US6506625B1Semiconductor package having stacked dice and leadframes and method of fabricationMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 14, 2003·62 cites·11 claims
- 3992US7829991B2Stackable ceramic FBGA for high thermal applicationsMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 9, 2010·17 cites·18 claims
- 4092US6414391B1Module assembly for stacked BGA packages with a common bus bar in the assemblyMICRON TECHNOLOGY INC·Filed 1999·Granted Jul 2, 2002·87 cites·23 claims
- 4192US5719440AFlip chip adaptor package for bare dieMICRON TECHNOLOGY INC·Filed 1995·Granted Feb 17, 1998·94 cites·10 claims
- 4291US6552427B2BGA package and method of fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 22, 2003·51 cites·15 claims
- 4391US6525943B2Heat sink with alignment and retaining featuresMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 25, 2003·36 cites·32 claims
- 4491US6455928B2Stackable ball grid array packageMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 24, 2002·41 cites·51 claims
- 4591US6153929ALow profile multi-IC package connectorMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 28, 2000·46 cites·64 claims
- 4691US6088237ASemiconductor device socket, assembly and methodsMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 11, 2000·43 cites·62 claims
- 4791US5539251ATie bar over chip lead frame designMICRON TECHNOLOGY INC·Filed 1995·Granted Jul 23, 1996·227 cites·22 claims
- 4891US5177032AMethod for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tapeMICRON TECHNOLOGY INC·Filed 1990·Granted Jan 5, 1993·105 cites·16 claims
- 4990US7408255B2Assembly for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 5, 2008·12 cites·19 claims
- 5090US7400032B2Module assembly for stacked BGA packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 15, 2008·12 cites·9 claims
Showing the top 50 of 218 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →