Inventor · disambiguated record
Norio Okabe
Also filed as: OKABE NORIO
14 granted patents·3 pending applications·403 citations·filing 1996–2006
94Inventor score
Top patents by PatentIndex Score
17 records- 0192USD567125SStress meterNIPRO CORP·Filed 2006·Granted Apr 22, 2008·66 cites·1 claims
- 0288US6114753ACircuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Sep 5, 2000·50 cites·23 claims
- 0382US6031292ASemiconductor device, interposer for semiconductor deviceHITACHI CABLE·Filed 1997·Granted Feb 29, 2000·66 cites·9 claims
- 0478US6281570B1Tape carrier for BGA and semiconductor device using the sameHITACHI CABLE·Filed 2000·Granted Aug 28, 2001·28 cites·6 claims
- 0573US6376916B1Tape carrier for BGA and semiconductor device using the sameHITACHI CABLE·Filed 2000·Granted Apr 23, 2002·21 cites·5 claims
- 0672US5837154AMethod of manufacturing double-sided circuit tape carrierHITACHI CABLE·Filed 1997·Granted Nov 17, 1998·45 cites·12 claims
- 0771US6791194B1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 14, 2004·18 cites·18 claims
- 0867US5866948AInterposer for semiconductor deviceHITACHI CABLE·Filed 1996·Granted Feb 2, 1999·31 cites·4 claims
- 0965US6433440B1Semiconductor device having a porous buffer layer for semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·24 cites·19 claims
- 1063US6323058B1Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor deviceHITACHI CABLE·Filed 1998·Granted Nov 27, 2001·27 cites·40 claims
- 1161US7202570B2Circuit tape having adhesive film semiconductor device and a method for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Apr 10, 2007·6 cites·23 claims
- 1259US6506627B1Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor deviceHITACHI CABLE·Filed 2000·Granted Jan 14, 2003·9 cites·28 claims
- 1351US7038325B2Wiring tape for semiconductor device including a buffer layer having interconnected foamsRENESAS TECH CORP·Filed 2004·Granted May 2, 2006·3 cites·9 claims
- 1443US6353259B1Process for producing BGA type semiconductor device, TAB tape for BGA type semiconductor device, and BGA type semiconductor deviceHITACHI CABLE·Filed 1999·Granted Mar 5, 2002·9 cites·4 claims
- 1540US2002160185A1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameFiled 2002·Application pending·0 cites
- 1640US2002158343A1Semiconductor device and wiring tape for semiconductor deviceFiled 2002·Application pending·0 cites
- 1738US2002030248A1Process for producing BGA type semiconductor device, TAB tape for BGA type semiconductor device, and BGA type semiconductor deviceHITACHI CABLE·Filed 2001·Application pending·0 cites
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