Inventor · disambiguated record
Adam Shepela
Also filed as: SHEPELA ADAM
6 granted patents·144 citations·filing 1989–2003
86Inventor score
Files withCOMPAQ COMPUTER CORP2HEWLETT PACKARD DEVELOPMENT CO2DIGITAL EQUIPMENT CORP1HEWLETT PACKARD DEVELOPMENT LP1
Top patents by PatentIndex Score
6 records- 0181US7062850B2Method of forming electrical interconnects having electromigration-inhibiting segments to a critical lengthHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jun 20, 2006·24 cites·15 claims
- 0279US6060387ATransistor fabrication process in which a contact metallization is formed with different silicide thickness over gate interconnect material and transistor source/drain regionsCOMPAQ COMPUTER CORP·Filed 1995·Granted May 9, 2000·53 cites·23 claims
- 0374US6678951B2Method of forming electrical interconnects having electromigration-inhibiting plugsHEWLETT PACKARD DEVELOPMENT CO·Filed 2000·Granted Jan 20, 2004·15 cites·4 claims
- 0469US6245996B1Electrical interconnect structure having electromigration-inhibiting segmentsCOMPAQ COMPUTER CORP·Filed 1999·Granted Jun 12, 2001·30 cites·12 claims
- 0565US6904675B1Method of forming electrical interconnects having electromigration-inhibiting plugsHEWLETT PACKARD DEVELOPMENT LP·Filed 2003·Granted Jun 14, 2005·11 cites·20 claims
- 0640US5094980AMethod for providing a metal-semiconductor contactDIGITAL EQUIPMENT CORP·Filed 1989·Granted Mar 10, 1992·11 cites·15 claims
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