Inventor · disambiguated record
Raymond Albert Fillion
Also filed as: FILLION RAYMOND A · FILLION RAYMOND ALBERT
57 granted patents·8 pending applications·5,259 citations·filing 1991–2022
99Inventor score
Files withGEN ELECTRIC46FILLION RAYMOND ALBERT7MARTIN MARIETTA CORP4WOYCHIK CHARLES GERARD2BRONECKE PETER N1
Top patents by PatentIndex Score
65 records- 0199US5353498AMethod for fabricating an integrated circuit moduleGEN ELECTRIC·Filed 1993·Granted Oct 11, 1994·1.2k cites·46 claims
- 0298US11411324B2Phased array antenna with isotropic and non-isotropic radiating and omnidirectional and non-omnidirectional receiving elementsFILLION RAYMOND ALBERT·Filed 2020·Granted Aug 9, 2022·56 cites·18 claims
- 0398US5527741AFabrication and structures of circuit modules with flexible interconnect layersMARTIN MARIETTA CORP·Filed 1994·Granted Jun 18, 1996·351 cites·13 claims
- 0497US10504826B1Device almost last embedded device structure and method of manufacturing thereofGEN ELECTRIC·Filed 2018·Granted Dec 10, 2019·24 cites·36 claims
- 0597US6396153B2Circuit chip package and fabrication methodGEN ELECTRIC·Filed 2001·Granted May 28, 2002·163 cites·10 claims
- 0697US6306680B1Power overlay chip scale packages for discrete power devicesGEN ELECTRIC·Filed 1999·Granted Oct 23, 2001·304 cites·26 claims
- 0797US5637922AWireless radio frequency power semiconductor devices using high density interconnectGEN ELECTRIC·Filed 1994·Granted Jun 10, 1997·272 cites·12 claims
- 0897US5532512ADirect stacked and flip chip power semiconductor device structuresGEN ELECTRIC·Filed 1994·Granted Jul 2, 1996·377 cites·22 claims
- 0997US5497033AEmbedded substrate for integrated circuit modulesMARTIN MARIETTA CORP·Filed 1994·Granted Mar 5, 1996·614 cites·6 claims
- 1096US7262444B2Power semiconductor packaging method and structureGEN ELECTRIC·Filed 2005·Granted Aug 28, 2007·50 cites·21 claims
- 1196US6242282B1Circuit chip package and fabrication methodGEN ELECTRIC·Filed 1999·Granted Jun 5, 2001·198 cites·20 claims
- 1296US6239482B1Integrated circuit package including window frameGEN ELECTRIC·Filed 1999·Granted May 29, 2001·217 cites·26 claims
- 1396US5353195AIntegral power and ground structure for multi-chip modulesGEN ELECTRIC·Filed 1993·Granted Oct 4, 1994·238 cites·19 claims
- 1495US10211141B1Semiconductor logic device and system and method of embedded packaging of sameGEN ELECTRIC·Filed 2017·Granted Feb 19, 2019·13 cites·27 claims
- 1594US9953913B1Electronics package with embedded through-connect structure and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Apr 24, 2018·10 cites·27 claims
- 1694US9953917B1Electronics package with embedded through-connect and resistor structure and method of manufacturing thereofGEN ELECTRIC·Filed 2016·Granted Apr 24, 2018·11 cites·34 claims
- 1794US5422513AIntegrated circuit chip placement in a high density interconnect structureMARTIN MARIETTA CORP·Filed 1993·Granted Jun 6, 1995·179 cites·8 claims
- 1891US5315486AHermetically packaged HDI electronic systemGEN ELECTRIC·Filed 1993·Granted May 24, 1994·178 cites·21 claims
- 1991US5291066AMoisture-proof electrical circuit high density interconnect module and method for making sameGEN ELECTRIC·Filed 1991·Granted Mar 1, 1994·154 cites·15 claims
- 2090US10396053B2Semiconductor logic device and system and method of embedded packaging of sameGEN ELECTRIC·Filed 2017·Granted Aug 27, 2019·7 cites·18 claims
- 2190US5455459AReconstructable interconnect structure for electronic circuitsMARTIN MARIETTA CORP·Filed 1994·Granted Oct 3, 1995·116 cites·10 claims
- 2288US11539144B2Phased array antenna with isotropic and non-isotropic radiating and omnidirectional and non-omnidirectional receiving elementsFILLION RAYMOND ALBERT·Filed 2022·Granted Dec 27, 2022·1 cites·19 claims
- 2388US8049338B2Power semiconductor module and fabrication methodGEN ELECTRIC·Filed 2006·Granted Nov 1, 2011·14 cites·22 claims
- 2488US7550097B2Thermal conductive material utilizing electrically conductive nanoparticlesMOMENTIVE PERFORMANCE MAT INC·Filed 2003·Granted Jun 23, 2009·53 cites·26 claims
- 2588US6507113B1Electronic interface structures and methods of fabricationGEN ELECTRIC·Filed 1999·Granted Jan 14, 2003·58 cites·17 claims
- 2688US5888837AChip burn-in and test structure and methodGEN ELECTRIC·Filed 1996·Granted Mar 30, 1999·83 cites·11 claims
- 2787US6239980B1Multimodule interconnect structure and processGEN ELECTRIC·Filed 1998·Granted May 29, 2001·91 cites·41 claims
- 2885US10276523B1Semiconductor logic device and system and method of embedded packaging of sameGEN ELECTRIC·Filed 2017·Granted Apr 30, 2019·4 cites·30 claims
- 2985US8466007B2Power semiconductor module and fabrication methodDELGADO ELADIO CLEMENTE·Filed 2011·Granted Jun 18, 2013·7 cites·4 claims
- 3081US10804115B2Electronics package with integrated interconnect structure and method of manufacturing thereofGEN ELECTRIC·Filed 2017·Granted Oct 13, 2020·3 cites·24 claims
- 3181US10692737B2Multilayer interconnect structure with buried conductive via connections and method of manufacturing thereofGEN ELECTRIC·Filed 2018·Granted Jun 23, 2020·3 cites·16 claims
- 3281US5946546AChip burn-in and test structure and methodGEN ELECTRIC·Filed 1998·Granted Aug 31, 1999·52 cites·7 claims
- 3380US8008781B2Apparatus and method for reducing pitch in an integrated circuitGEN ELECTRIC·Filed 2008·Granted Aug 30, 2011·9 cites·20 claims
- 3480US7303947B1Source bridge for cooling and/or external connectionLOCKHEED CORP·Filed 2005·Granted Dec 4, 2007·10 cites·12 claims
- 3579US10838059B2Acoustic phased array antenna with isotropic and non-isotropic radiating elementsFILLION RAYMOND ALBERT·Filed 2019·Granted Nov 17, 2020·3 cites·12 claims
- 3678US7829386B2Power semiconductor packaging method and structureGEN ELECTRIC·Filed 2007·Granted Nov 9, 2010·8 cites·27 claims
- 3777US10497648B2Embedded electronics package with multi-thickness interconnect structure and method of making sameGEN ELECTRIC·Filed 2018·Granted Dec 3, 2019·2 cites·33 claims
- 3875US8498131B2Interconnect structureFILLION RAYMOND ALBERT·Filed 2011·Granted Jul 30, 2013·3 cites·10 claims
- 3974US11749909B2Phased array antenna with isotropic and non-isotropic radiating and omnidirectional and non-omnidirectional receiving elementsFILLION RAYMOND ALBERT·Filed 2022·Granted Sep 5, 2023·0 cites·23 claims
- 4074US10332832B2Method of manufacturing an electronics package using device-last or device-almost last placementGEN ELECTRIC·Filed 2017·Granted Jun 25, 2019·2 cites·21 claims
- 4173US10804116B2Electronics package with integrated interconnect structure and method of manufacturing thereofGEN ELECTRIC·Filed 2019·Granted Oct 13, 2020·1 cites·20 claims
- 4270US5703440ACompact fluorescent lamp and ballast arrangement with inductor directly between lamp endsGEN ELECTRIC·Filed 1996·Granted Dec 30, 1997·34 cites·18 claims
- 4369US7964974B2Electronic chip package with reduced contact pad pitchGEN ELECTRIC·Filed 2008·Granted Jun 21, 2011·4 cites·20 claims
- 4468US5691598AFluorescent lamp with thermal heat shield between lamp tube and ballast circuitryGEN ELECTRIC·Filed 1995·Granted Nov 25, 1997·23 cites·17 claims
- 4567US8674212B2Solar cell and magnetically self-assembled solar cell assemblyHUBER WILLIAM HULLINGER·Filed 2008·Granted Mar 18, 2014·5 cites·22 claims
- 4667US6933813B2Interconnection structure with etch stopGEN ELECTRIC·Filed 2003·Granted Aug 23, 2005·11 cites·4 claims
- 4766US5324987AElectronic apparatus with improved thermal expansion matchGEN ELECTRIC·Filed 1993·Granted Jun 28, 1994·34 cites·20 claims
- 4862US8259454B2Interconnect structure including hybrid frame panelFILLION RAYMOND ALBERT·Filed 2008·Granted Sep 4, 2012·3 cites·24 claims
- 4960US10892231B2Electronics package including integrated electromagnetic interference shield and method of manufacturing thereofGEN ELECTRIC·Filed 2019·Granted Jan 12, 2021·0 cites·20 claims
- 5059US6671948B2Interconnection method using an etch stopGEN ELECTRIC·Filed 2000·Granted Jan 6, 2004·7 cites·13 claims
Showing the top 50 of 65 patent records by PatentIndex Score.
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