Inventor · disambiguated record
Meng-Hsien Lin
Also filed as: LIN MENG · LIN MENG H · LIN MENG-HSIEN
11 granted patents·24 pending applications·41 citations·filing 1994–2025
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15LIN MENG-HSIEN8CHANG YAO-TING3HON HAI PREC IND CO LTD3NAT UNIV TSING HUA2
Top patents by PatentIndex Score
35 records- 0192US12154939B2High capacitance MIM device with self aligned spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·1 cites·20 claims
- 0281US8309185B2Nanoparticle film and forming method and application thereofLIN MENG-HSIEN·Filed 2010·Granted Nov 13, 2012·4 cites·15 claims
- 0379US8295991B2Fan speed control system and methodCHANG YAO-TING·Filed 2010·Granted Oct 23, 2012·4 cites·1 claims
- 0477US2024387613A1Capacitor device with self aligned spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0577US2025357348A1Barrier free tungsten liner in contact plugs and the method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0675US8300403B2Computer system and heat sinkCHANG YAO-TING·Filed 2010·Granted Oct 30, 2012·4 cites·12 claims
- 0773US8606429B2System and method for controlling an electronic device fanLIN MENG-HSIEN·Filed 2010·Granted Dec 10, 2013·3 cites·17 claims
- 0873US2025357313A1Embedded capacitors with shared electrodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0968US5542770AMultifunctional micropocessor input deviceFiled 1994·Granted Aug 6, 1996·23 cites·5 claims
- 1067US11769791B2High capacitance MIM device with self aligned spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
- 1167US2024355740A1Barrier Free Tungsten Liner in Contact Plugs and The Method Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1266US12176664B2Power connector moduleDELTA ELECTRONICS INC·Filed 2022·Granted Dec 24, 2024·0 cites·10 claims
- 1362US11742748B1Electronic device and protection method thereofQISDA CORP·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 1462US8077465B2Heat sink assembly with fixing memberCHANG YAO-TING·Filed 2009·Granted Dec 13, 2011·2 cites·3 claims
- 1562US2025301812A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1661US2025309095A1Capacitor structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1760US2025022912A1High density capacitor and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1860US2025203884A1Metal-insulator-metal capacitor with partial bottom landingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1960US2025201696A1Integrated circuit with noise reducing capacitor and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2059US2025126812A1Integrated circuit fabrication employing self-aligned maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2158US2023411277A1Embedded capacitors with shared electrodesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2255US2025048658A1Capacitor array formation using single etch processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2354US2024096784A1Extended via connect for pixel arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2454US2011102998A1Disk drive assembly and electronic device having the sameHON HAI PREC IND CO LTD·Filed 2009·Application pending·0 cites
- 2547US2015016031A1Packing piece and packing member formed from the packing pieceHON HAI PREC IND CO LTD·Filed 2013·Application pending·0 cites
- 2647US2011006035A1Method for modifying surface in selective areas and method for forming patternsNAT UNIV TSING HUA·Filed 2009·Application pending·0 cites
- 2743US2015144317A1Heat dissipating moduleHON HAI PREC IND CO LTD·Filed 2014·Application pending·0 cites
- 2838US8228672B2Computer enclosure including air guide membersLIN MENG-HSIEN·Filed 2010·Granted Jul 24, 2012·0 cites·20 claims
- 2938US2006232912A1Electronic device capable of cleaning a display panelLIN MENG-HSIEN·Filed 2006·Application pending·0 cites
- 3038US2013208427A1Grounding mechanism for heat sink assemblyLIN MENG-HSIEN·Filed 2012·Application pending·0 cites
- 3137US2013126214A1Fixing apparatus for heat sinkLIN MENG-HSIEN·Filed 2011·Application pending·0 cites
- 3236US2017261434A1Sers substrateNAT UNIV TSING HUA·Filed 2016·Application pending·0 cites
- 3334US2012152509A1Heat sinkLIN MENG-HSIEN·Filed 2010·Application pending·0 cites
- 3434US2012138273A1Heat sink with thermally conductive coverLIN MENG-HSIEN·Filed 2010·Application pending·0 cites
- 3526US2017342061A1Crystal form i of canagliflozin and preparation method thereofCHONGQING PHARMACEUTICAL INDUSTRIAL RES INSTITUTE CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →