Inventor · disambiguated record
Stefan Mollov
Also filed as: MOLLOV STEFAN
34 granted patents·3 pending applications·36 citations·filing 2012–2021
94Inventor score
Top patents by PatentIndex Score
37 records- 0192US10705133B2Method and device for estimating level of damage or lifetime expectation of power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 7, 2020·6 cites·8 claims
- 0285US10476464B2Common mode filter device and electrical equipmentMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Nov 12, 2019·7 cites·13 claims
- 0384US10985088B2System comprising at least one power module comprising at least one power die that is cooled by liquid cooled systemMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Apr 20, 2021·5 cites·11 claims
- 0484US9739735B2Method and system for on-line monitoring electrolytic capacitor conditionMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 22, 2017·4 cites·12 claims
- 0581US11121059B2Power module and method for manufacturing power moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 14, 2021·4 cites·11 claims
- 0675US11251151B2System and method for allowing restoration of interconnection of die of power moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 15, 2022·2 cites·13 claims
- 0773US11114349B2System and method for allowing restoration of first interconnection of die of power moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 7, 2021·2 cites·10 claims
- 0869US11448557B2Method and device for determining junction temperature of die of semiconductor power moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 20, 2022·1 cites·19 claims
- 0964US10782338B2Method and device for estimating level of damage or lifetime expectation of power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 22, 2020·1 cites·13 claims
- 1063US11152340B2Power module having a multilayered structure with liquid cooled busbar and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 19, 2021·1 cites·4 claims
- 1162US12416528B2Device and method for sensing an over-temperature of a power semiconductorMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Sep 16, 2025·0 cites·13 claims
- 1262US10277218B2System comprising multi-die power module, method for controlling operation of multi-die power module, device for controlling operation of multi-die power moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Apr 30, 2019·1 cites·10 claims
- 1358US9774185B2Secured and regulated continuous power supply system with multiple inputsTHALES SA·Filed 2012·Granted Sep 26, 2017·2 cites·7 claims
- 1455US11929346B2Device and method for increasing the reliability of a power moduleMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Mar 12, 2024·0 cites·11 claims
- 1553US12013428B2Method and device for monitoring gate signal of power semiconductorMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Jun 18, 2024·0 cites·14 claims
- 1653US11378612B2Device and method for monitoring the health of a power semiconductor dieMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 5, 2022·0 cites·17 claims
- 1752US12270715B2Method for estimating parameters of a junction of a power semi-conductor element and power unitMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Apr 8, 2025·0 cites·18 claims
- 1852US11955539B2Device and method for manufacturing deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Apr 9, 2024·0 cites·12 claims
- 1949US10333385B2Method and device for controlling the operation of multi-die power moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jun 25, 2019·0 cites·15 claims
- 2048US10732617B2Method, device and system for estimating level of damage of electric device using histogramsMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 4, 2020·0 cites·12 claims
- 2148US10495681B2System and method for determining if deterioration occurs in interface of semiconductor die of electric power moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Dec 3, 2019·0 cites·12 claims
- 2248US9469411B2Power supply system with heterogeneous multiple inputTHALES SA·Filed 2012·Granted Oct 18, 2016·0 cites·16 claims
- 2347US11038498B2Device and method for controlling switchingMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jun 15, 2021·0 cites·10 claims
- 2446US11152934B2Device and method for controlling switchingMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 19, 2021·0 cites·9 claims
- 2546US10367497B2System comprising multi-die power and method for controlling operation of multi-die power moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 30, 2019·0 cites·10 claims
- 2646US2024014046A1Method and device for making integrated cooling liquid cavity in printed circuit boardMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2745US11735998B2System and method for protecting power semiconductor of half bridge converterMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Aug 22, 2023·0 cites·9 claims
- 2845US11630154B2Method and device for monitoring connection of semiconductor of power moduleMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Apr 18, 2023·0 cites·17 claims
- 2945US10848052B2Device and method for controlling temperature of multi-die power moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Nov 24, 2020·0 cites·10 claims
- 3045US10827619B2Printed circuit board and method for manufacturing printed circuit boardMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Nov 3, 2020·0 cites·13 claims
- 3145US10084440B2System comprising a multi-die power module, and method for controlling the switching of a multi-die power moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 25, 2018·0 cites·10 claims
- 3244US11791254B2Electrically power assembly with thick electrically conductive layersMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Oct 17, 2023·0 cites·15 claims
- 3342US11217571B2Power module and method for manufacturing power moduleMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jan 4, 2022·0 cites·15 claims
- 3442US2023145900A1Half bridge power converter, and switching method for half bridge power converter and power switchMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 3540US10707744B2Device and method for controlling operation of power module composed of switchesMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 7, 2020·0 cites·15 claims
- 3639US2021143103A1Power module and method for manufacturing power moduleMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 3735US9515012B2Package of power dies and three-phase power converterMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Dec 6, 2016·0 cites·6 claims
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