Inventor · disambiguated record
Tomonori Minegishi
Also filed as: MINEGISHI TOMONORI
14 granted patents·3 pending applications·77 citations·filing 2000–2020
90Inventor score
Top patents by PatentIndex Score
17 records- 0191US8758977B2Negative-type photosensitive resin composition, pattern forming method and electronic partsMINEGISHI TOMONORI·Filed 2011·Granted Jun 24, 2014·8 cites·14 claims
- 0289US8304160B2Photosensitive resin composition and circuit formation substrate using the sameMINEGISHI TOMONORI·Filed 2010·Granted Nov 6, 2012·8 cites·12 claims
- 0382US8871422B2Negative-type photosensitive resin composition, pattern forming method and electronic partsMINEGISHI TOMONORI·Filed 2006·Granted Oct 28, 2014·6 cites·10 claims
- 0482US8298747B2Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic partMINEGISHI TOMONORI·Filed 2008·Granted Oct 30, 2012·10 cites·24 claims
- 0581US10674612B2Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layerHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jun 2, 2020·3 cites·8 claims
- 0679US11330721B2Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin filmHITACHI CHEMICAL CO LTD·Filed 2020·Granted May 10, 2022·1 cites·7 claims
- 0774US8614051B2Photosensitive resin composition and circuit formation substrate using the sameMINEGISHI TOMONORI·Filed 2012·Granted Dec 24, 2013·3 cites·13 claims
- 0874US6436593B1Positive photosensitive resin composition, process for producing pattern and electronic partsHITACHI CHEM DUPONT MICROSYS·Filed 2000·Granted Aug 20, 2002·33 cites·13 claims
- 0970US11147166B2Method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 12, 2021·1 cites·6 claims
- 1069US9274422B2Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic componentMINEGISHI TOMONORI·Filed 2012·Granted Mar 1, 2016·2 cites·18 claims
- 1167US10575402B2Resin composition, wiring layer laminate for semiconductor, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 25, 2020·1 cites·17 claims
- 1261US10428253B2Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Oct 1, 2019·1 cites·17 claims
- 1342US2010159217A1Negative-type photosensitive resin composition, method for forming patterns, and electronic partsHITACHI CHEM DUPONT MICROSYS·Filed 2006·Application pending·0 cites
- 1442US2013143011A1Photosensitive resin compositionHITACHI CHEM DUPONT MICROSYS·Filed 2012·Application pending·0 cites
- 1541US8420291B2Positive photosensitive resin composition, method for forming pattern, electronic componentMINEGISHI TOMONORI·Filed 2008·Granted Apr 16, 2013·0 cites·5 claims
- 1635US2019241694A1Curable composition for forming elastic resin layerHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 1726US9134608B2Positive photosensitive resin composition, method for producing patterned cured film and electronic componentKOTANI MASASHI·Filed 2011·Granted Sep 15, 2015·0 cites·9 claims
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