Inventor · disambiguated record
Tang-Yuan Chen
Also filed as: CHEN TANG-YUAN
14 granted patents·2 pending applications·43 citations·filing 2015–2025
89Inventor score
Files withADVANCED SEMICONDUCTOR ENG16
Top patents by PatentIndex Score
16 records- 0193US11742324B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 29, 2023·2 cites·12 claims
- 0290US9478500B2Interposer substrate, semiconductor structure and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Oct 25, 2016·10 cites·24 claims
- 0389US10332862B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 25, 2019·6 cites·30 claims
- 0489US10217649B2Semiconductor device package having an underfill barrierADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Feb 26, 2019·9 cites·20 claims
- 0588US10586716B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 10, 2020·7 cites·21 claims
- 0686US11011496B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 18, 2021·3 cites·17 claims
- 0785US10770369B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Sep 8, 2020·5 cites·16 claims
- 0881US12166009B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 0976US2025234680A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1075US12272766B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Apr 8, 2025·0 cites·16 claims
- 1166US11594660B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 28, 2023·0 cites·13 claims
- 1263US9589871B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Mar 7, 2017·1 cites·14 claims
- 1361US11164756B2Semiconductor device package having continously formed tapered protrusionsADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 2, 2021·0 cites·18 claims
- 1458US10840219B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 17, 2020·0 cites·19 claims
- 1550US11227823B2Wiring structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 1637US2020381338A1Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →