Inventor · disambiguated record
Willem Frederik Adrianus Besling
Also filed as: BESLING WILLEM · BESLING WILLEM F A · BESLING WILLEM FREDERIK ADRIAN · BESLING WILLEM FREDERIK ADRIANUS
44 granted patents·7 pending applications·239 citations·filing 2001–2022
97Inventor score
Top patents by PatentIndex Score
51 records- 0198US9772245B2MEMS capacitive pressure sensorAMS INT AG·Filed 2013·Granted Sep 26, 2017·73 cites·17 claims
- 0295US9608297B2In-cell battery management deviceVAN LAMMEREN JOHANNES PETRUS MARIA·Filed 2011·Granted Mar 28, 2017·16 cites·12 claims
- 0395US9383282B2MEMS capacitive pressure sensor, operating method and manufacturing methodBESLING WILLEM FREDERIK ADRIANUS·Filed 2012·Granted Jul 5, 2016·25 cites·19 claims
- 0493US9383285B2MEMS resonator pressure sensorAMS INTERNAT AG·Filed 2013·Granted Jul 5, 2016·16 cites·13 claims
- 0591US8833171B2Pressure sensorBESLING WILLEM FREDERIK ADRIANUS·Filed 2012·Granted Sep 16, 2014·15 cites·25 claims
- 0688US9340412B2Suspended membrane for capacitive pressure sensorAMS INTERNAT AG·Filed 2014·Granted May 17, 2016·10 cites·20 claims
- 0786US9184469B2BatteryJEDEMA FRISO JACOBUS·Filed 2011·Granted Nov 10, 2015·7 cites·18 claims
- 0886US9105479B2Integrated circuit including an environmental sensorNXP BV·Filed 2013·Granted Aug 11, 2015·16 cites·12 claims
- 0984US10743112B2Microphone and pressure sensor package and method of producing the microphone and pressure sensor packageSCIOSENSE BV·Filed 2017·Granted Aug 11, 2020·4 cites·19 claims
- 1083US8622310B2Token comprising improved physical unclonable functionBESLING WILLEM FREDERIK ADRIANUS·Filed 2010·Granted Jan 7, 2014·8 cites·15 claims
- 1180US10060817B2Integrated circuit with a pressure sensorAMS INT AG·Filed 2016·Granted Aug 28, 2018·2 cites·7 claims
- 1279US11248976B2Capacitive pressure sensors and other devices having a suspended membrane and having rounded corners at an anchor edgeSCIOSENSE BV·Filed 2018·Granted Feb 15, 2022·2 cites·24 claims
- 1379US9726561B2Differential pressure sensor with a capacitive read out systemAMS INT AG·Filed 2014·Granted Aug 8, 2017·6 cites·12 claims
- 1478US8445382B2Side wall pore sealing for low-k dielectricsBESLING WILLEM FREDERIK ADRIANUS·Filed 2006·Granted May 21, 2013·8 cites·9 claims
- 1576US11585711B2Capacitive pressure with Ti electrodeSCIOSENSE BV·Filed 2019·Granted Feb 21, 2023·2 cites·20 claims
- 1676US9737245B2Flexible eye insert and glucose measuring systemBESLING WILLEM FREDERIK ADRIANUS·Filed 2012·Granted Aug 22, 2017·4 cites·19 claims
- 1773US11878906B2Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer deviceSCIOSENSE BV·Filed 2022·Granted Jan 23, 2024·0 cites·16 claims
- 1873US11366031B2Semiconductor device and method for forming a semiconductor deviceSCIOSENSE BV·Filed 2017·Granted Jun 21, 2022·1 cites·16 claims
- 1971US9778238B2Resonant CO2 sensing with mitigation of cross-sensitivitiesAMS INT AG·Filed 2014·Granted Oct 3, 2017·1 cites·9 claims
- 2069US9513184B2MEMS device calibrationAMS INT AG·Filed 2014·Granted Dec 6, 2016·3 cites·23 claims
- 2169US2023126598A1Attachment of Stress Sensitive Integrated Circuit DiesSCIOSENSE BV·Filed 2022·Application pending·0 cites
- 2268US9557238B2Pressure sensor with geter embedded in membraneNXP BV·Filed 2014·Granted Jan 31, 2017·3 cites·13 claims
- 2368US2022221363A1Pressure Sensor Device and Method for Forming a Pressure Sensor DeviceSCIOSENSE BV·Filed 2022·Application pending·0 cites
- 2466US11448564B2Sensor arrangement and method of operating a sensor arrangementSCIOSENSE BV·Filed 2019·Granted Sep 20, 2022·1 cites·12 claims
- 2566US6562732B2Method of manufacturing a semiconductor deviceKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted May 13, 2003·14 cites·9 claims
- 2665US12180066B2Sensor package and method of producing the sensor packageSCIOSENSE BV·Filed 2021·Granted Dec 31, 2024·0 cites·16 claims
- 2762US11313749B2Pressure sensor device and method for forming a pressure sensor deviceSCIOSENSE BV·Filed 2017·Granted Apr 26, 2022·0 cites·9 claims
- 2862US8794075B2Multilayered NONON membrane in a MEMS sensorBESLING WILLEM FREDERIK ADRIANUS·Filed 2011·Granted Aug 5, 2014·2 cites·22 claims
- 2961US11492251B2Method for manufacturing an integrated MEMS transducer device and integrated MEMS transducer deviceSCIOSENSE BV·Filed 2019·Granted Nov 8, 2022·0 cites·9 claims
- 3055US11548781B2Attachment of stress sensitive integrated circuit diesSCIOSENSE BV·Filed 2018·Granted Jan 10, 2023·0 cites·8 claims
- 3155US9481570B2Method of manufacturing an integrated circuit comprising a pressure sensorAMS INT AG·Filed 2016·Granted Nov 1, 2016·0 cites·7 claims
- 3254US9269832B2Integrated circuit with pressure sensor having a pair of electrodesAMS INTERNAT AG·Filed 2013·Granted Feb 23, 2016·0 cites·17 claims
- 3353US11427465B2Capacitive sensors having temperature stable outputSCIOSENSE BV·Filed 2019·Granted Aug 30, 2022·0 cites·21 claims
- 3452US9604134B2Device control system and method of determining altitudeAMS INT AG·Filed 2013·Granted Mar 28, 2017·0 cites·15 claims
- 3552US2011272786A1Energy storage systemNXP BV·Filed 2009·Application pending·0 cites
- 3651US11946822B2Semiconductor transducer device with multilayer diaphragm and method of manufacturing a semiconductor transducer device with multilayer diaphragmSCIOSENSE BV·Filed 2019·Granted Apr 2, 2024·0 cites·20 claims
- 3751US11001495B2Sensor package and method of producing the sensor packageSCIOSENSE BV·Filed 2017·Granted May 11, 2021·0 cites·19 claims
- 3850US11209322B2Integrated temperature sensor, method for producing an integrated temperature sensor and method for determining a temperature by means of an integrated temperature sensorAMS INT AG·Filed 2017·Granted Dec 28, 2021·0 cites·20 claims
- 3950US8916940B2Method of forming a nanocluster-comprising dielectric layer and device comprising such a layerTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Dec 23, 2014·0 cites·18 claims
- 4049US11454562B2Sensor arrangement and method of operating a sensor arrangementSCIOSENSE BV·Filed 2019·Granted Sep 27, 2022·0 cites·12 claims
- 4149US8455357B2Method of plating through wafer vias in a wafer for 3D packagingBESLING WILLEM FREDERIK ADRIANUS·Filed 2009·Granted Jun 4, 2013·0 cites·14 claims
- 4249US2011183186A1Solid state batteryNXP BV·Filed 2009·Application pending·0 cites
- 4348US12191402B2Method of manufacturing a semiconductor transducer device with multilayer diaphragm and semiconductor transducer device with multilayer diaphragmSCIOSENSE BV·Filed 2019·Granted Jan 7, 2025·0 cites·10 claims
- 4447US8324117B2Method of forming a nanocluster-comprising dielectric layer and device comprising such a layerKOCHUPURACKAL JINESH BALAKRISHNA PILLAI·Filed 2009·Granted Dec 4, 2012·0 cites·9 claims
- 4545US8809982B2Robust high aspect ratio semiconductor deviceROOZEBOOM FREDDY·Filed 2009·Granted Aug 19, 2014·0 cites·22 claims
- 4645US2022260446A1Sensor Arrangement and Method for Fabricating A Sensor ArrangementSCIOSENSE BV·Filed 2020·Application pending·0 cites
- 4743US10444103B2Method and apparatus for calibrating pressure sensor integrated circuit devicesAMS INT AG·Filed 2014·Granted Oct 15, 2019·0 cites·7 claims
- 4843US10267702B2Force sensor with compensationNXP BV·Filed 2015·Granted Apr 23, 2019·0 cites·12 claims
- 4938US2012286846A1Switching circuitWUNNICKE OLAF·Filed 2011·Application pending·0 cites
- 5033US2011278952A1Capacitive dc-dc converterREIMANN KLAUS·Filed 2009·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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