Inventor · disambiguated record
Bo-I Lee
Also filed as: LEE BO-I · LEE BO-IN
21 granted patents·5 pending applications·191 citations·filing 2008–2024
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7TAIWAN SEMICONDUCTOR MFG5LEE BO-I4WU JIANN LIH3CATHOLIC UNIV KOREA IND ACADEMIC COOPERATION FOUNDATION2
Top patents by PatentIndex Score
26 records- 0197US9275924B2Semiconductor package having a recess filled with a molding compoundWANG TSUNG-DING·Filed 2012·Granted Mar 1, 2016·64 cites·19 claims
- 0294US8803332B2Delamination resistance of stacked dies in die sawLEE BO-I·Filed 2010·Granted Aug 12, 2014·29 cites·20 claims
- 0391US7851346B2Bonding metallurgy for three-dimensional interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Dec 14, 2010·22 cites·19 claims
- 0489US8743561B2Wafer-level molded structure for package assemblyWANG TSUNG-DING·Filed 2010·Granted Jun 3, 2014·9 cites·8 claims
- 0589US8426256B2Method of forming stacked-die packagesHSIAO C W·Filed 2010·Granted Apr 23, 2013·21 cites·20 claims
- 0686US9754917B2Method of forming wafer-level molded structure for package assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·4 cites·20 claims
- 0785US9406632B2Semiconductor package including a substrate with a stepped sidewall structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·6 cites·20 claims
- 0883US7687311B1Method for producing stackable diesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Mar 30, 2010·11 cites·19 claims
- 0979US8242611B2Bonding metallurgy for three-dimensional interconnectLEE BO-I·Filed 2010·Granted Aug 14, 2012·5 cites·20 claims
- 1078US9117939B2Method of forming wafer-level molded structure for package assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 25, 2015·3 cites·20 claims
- 1175US10857649B2Method and apparatus for performing a polishing process in semiconductor fabricationLEE BO I·Filed 2011·Granted Dec 8, 2020·4 cites·18 claims
- 1275US9138861B2CMP pad cleaning apparatusWU JIANN LIH·Filed 2012·Granted Sep 22, 2015·5 cites·20 claims
- 1372US9403254B2Methods for real-time error detection in CMP processingHWANG JAMES JENG-JYI·Filed 2011·Granted Aug 2, 2016·4 cites·18 claims
- 1469US8932906B2Through silicon via bonding structureWANG DEAN·Filed 2008·Granted Jan 13, 2015·4 cites·20 claims
- 1569US2024386686A1Electronic device interlocked with endoscope to perform endoscopic examination and method for performing endoscopic examination using the sameCATHOLIC UNIV KOREA IND ACADEMIC COOPERATION FOUNDATION·Filed 2024·Application pending·0 cites
- 1662US11413722B2Apparatus and method for chemically mechanically polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 1761US10668592B2Method of planarizing a waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 2, 2020·0 cites·20 claims
- 1857US2015158143A1Apparatus and method for chemically mechanically polishingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 1950US9242342B2Manufacture and method of making the sameLEE BO-I·Filed 2012·Granted Jan 26, 2016·0 cites·20 claims
- 2049US10163710B2Method of manufacturing semiconductor device by applying molding layer in substrate grooveTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 2147US9570368B2Method of manufacturing semiconductor package including forming a recessed region in a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·0 cites·19 claims
- 2246US9673174B2Through silicon via bonding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 6, 2017·0 cites·20 claims
- 2337US2010225011A1System and Method for Integrated Circuit FabricationTAIWAN SEMICONDUCTOR MFG·Filed 2010·Application pending·0 cites
- 2434US2013217306A1CMP Groove Depth and Conditioning Disk MonitoringWU JIANN LIH·Filed 2012·Application pending·0 cites
- 2534US2013210173A1Multiple Zone Temperature Control for CMPWU JIANN LIH·Filed 2012·Application pending·0 cites
- 2633US11690737B2Stent using wireless transmitted power and external operating apparatus thereofCATHOLIC UNIV KOREA IND ACADEMIC COOPERATION FOUNDATION·Filed 2016·Granted Jul 4, 2023·0 cites·2 claims
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