Inventor · disambiguated record
Masanori Minamio
Also filed as: MINAMIO MASANORI
109 granted patents·29 pending applications·2,530 citations·filing 1996–2020
99Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD49PANASONIC CORP46MINAMIO MASANORI15MATSUSHITA ELECTRONICS CORP6PANASONIC IP MAN CO LTD6
Top patents by PatentIndex Score
138 records- 0197US7495319B2Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the samePANASONIC CORP·Filed 2005·Granted Feb 24, 2009·59 cites·11 claims
- 0297US6225146B1Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted May 1, 2001·247 cites·20 claims
- 0396US6642609B1Leadframe for a semiconductor device having leads with land electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 4, 2003·106 cites·8 claims
- 0496US6208020B1Leadframe for use in manufacturing a resin-molded semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted Mar 27, 2001·362 cites·15 claims
- 0595US6130115APlastic encapsulated semiconductor device and method of manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted Oct 10, 2000·210 cites·4 claims
- 0695US5942794APlastic encapsulated semiconductor device and method of manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1997·Granted Aug 24, 1999·230 cites·13 claims
- 0794US6674154B2Lead frame with multiple rows of external terminalsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 6, 2004·104 cites·6 claims
- 0894US6638790B2Leadframe and method for manufacturing resin-molded semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 28, 2003·69 cites·2 claims
- 0994US5977615ALead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1997·Granted Nov 2, 1999·159 cites·27 claims
- 1093US7405104B2Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Jul 29, 2008·26 cites·10 claims
- 1192US6897428B2Solid-state imaging device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted May 24, 2005·70 cites·13 claims
- 1292US6710430B2Resin-encapsulated semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 23, 2004·85 cites·8 claims
- 1391US7939901B2Optical device for reducing disturbance light and manufacturing method thereofPANASONIC CORP·Filed 2008·Granted May 10, 2011·21 cites·5 claims
- 1490US7822090B2Semiconductor devicePANASONIC CORP·Filed 2008·Granted Oct 26, 2010·12 cites·17 claims
- 1589US6861734B2Resin-molded semiconductor deviceMATSUSHITA ELECRTRIC IND CO LT·Filed 2003·Granted Mar 1, 2005·47 cites·7 claims
- 1688US6338984B2Resin-molded semiconductor device, method for manufacturing the same, and leadframeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 15, 2002·54 cites·6 claims
- 1787US8772923B2Semiconductor device having leads with cutout and method of manufacturing the sameMINAMIO MASANORI·Filed 2012·Granted Jul 8, 2014·8 cites·16 claims
- 1887US7755030B2Optical device including a wiring having a reentrant cavityPANASONIC CORP·Filed 2008·Granted Jul 13, 2010·12 cites·14 claims
- 1986US9136193B2Semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2012·Granted Sep 15, 2015·8 cites·11 claims
- 2085US9907877B2Sanitization mist shower apparatusPANASONIC IP MAN CO LTD·Filed 2016·Granted Mar 6, 2018·5 cites·4 claims
- 2185US8471373B2Resin-sealed semiconductor device and method for fabricating the sameMINAMIO MASANORI·Filed 2011·Granted Jun 25, 2013·8 cites·18 claims
- 2284US7582944B2Optical apparatus and optical module using the samePANASONIC CORP·Filed 2007·Granted Sep 1, 2009·13 cites·19 claims
- 2384US7166908B2Optical deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 23, 2007·12 cites·4 claims
- 2484US7132315B2Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Nov 7, 2006·12 cites·6 claims
- 2584US6680220B2Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor packageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 20, 2004·32 cites·6 claims
- 2684US6650020B2Resin-sealed semiconductor deviceMATSUSHIA ELECTRIC IND CO LTD·Filed 2002·Granted Nov 18, 2003·38 cites·4 claims
- 2783US7265340B2Optical device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Sep 4, 2007·12 cites·14 claims
- 2883US6984880B2Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 10, 2006·34 cites·4 claims
- 2982US7834926B2Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method thereforPANASONIC CORP·Filed 2006·Granted Nov 16, 2010·11 cites·20 claims
- 3081US7049684B2Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 23, 2006·25 cites·14 claims
- 3180US9572291B2Semiconductor device and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Feb 14, 2017·4 cites·15 claims
- 3279US8686545B2Semiconductor device and method for manufacturing the sameMINAMIO MASANORI·Filed 2011·Granted Apr 1, 2014·5 cites·17 claims
- 3379US7273765B2Solid-state imaging device and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Sep 25, 2007·28 cites·17 claims
- 3478US9030003B2Encapsulated semiconductor device and method for manufacturing the sameMINAMIO MASANORI·Filed 2012·Granted May 12, 2015·4 cites·10 claims
- 3578US6692991B2Resin-encapsulated semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 17, 2004·19 cites·4 claims
- 3677US7790270B2Wiring board and semiconductor devicePANASONIIC CORP·Filed 2007·Granted Sep 7, 2010·9 cites·12 claims
- 3777US6909168B2Resin encapsulation semiconductor device utilizing grooved leads and die padMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 21, 2005·21 cites·10 claims
- 3876US7367120B2Method for producing a solid-state imaging deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted May 6, 2008·7 cites·1 claims
- 3975US11085692B2Magnetic gasket and cooling apparatusPANASONIC CORP·Filed 2019·Granted Aug 10, 2021·3 cites·6 claims
- 4075US9240369B2Encapsulated semiconductor device and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 19, 2016·2 cites·11 claims
- 4175US7247509B2Method for manufacturing solid-state imaging devicesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 24, 2007·24 cites·3 claims
- 4275US7026192B2Terminal land frame and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 11, 2006·19 cites·11 claims
- 4374US7547955B2Semiconductor imaging device and method for manufacturing the samePANASONIC CORP·Filed 2007·Granted Jun 16, 2009·6 cites·7 claims
- 4474US7042071B2Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 9, 2006·18 cites·13 claims
- 4574US6720207B2Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 13, 2004·21 cites·28 claims
- 4673US7816777B2Semiconductor-element mounting substrate, semiconductor device, and electronic equipmentPANASONIC CORP·Filed 2006·Granted Oct 19, 2010·7 cites·19 claims
- 4773US6680524B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 20, 2004·20 cites·5 claims
- 4872US8077900B2Microphone and method for fabricating the sameMINAMIO MASANORI·Filed 2009·Granted Dec 13, 2011·5 cites·14 claims
- 4972US8018526B2Optical device module, fabrication method thereof, optical device unit and fabrication method thereofPANASONIC CORP·Filed 2007·Granted Sep 13, 2011·3 cites·20 claims
- 5072US7563644B2Optical device and method for fabricating the samePANASONIC CORP·Filed 2008·Granted Jul 21, 2009·3 cites·4 claims
Showing the top 50 of 138 patent records by PatentIndex Score.
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