Inventor · disambiguated record
Yasuhiro Yamaji
Also filed as: YAMAJI YASUHIRO
16 granted patents·1 pending application·1,106 citations·filing 1987–2012
96Inventor score
Top patents by PatentIndex Score
17 records- 0198US5394303ASemiconductor deviceTOSHIBA KK·Filed 1993·Granted Feb 28, 1995·425 cites·8 claims
- 0289US6159837AManufacturing method of semiconductor deviceTOSHIBA KK·Filed 1999·Granted Dec 12, 2000·106 cites·16 claims
- 0389US5536973ASemiconductor device including a semiconductor element mounted on a substrate using bump-shaped connecting electrodesTOSHIBA KK·Filed 1995·Granted Jul 16, 1996·105 cites·7 claims
- 0485US7015572B2Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor systemTOSHIBA KK·Filed 2004·Granted Mar 21, 2006·41 cites·19 claims
- 0584US5925936ASemiconductor device for face down bonding to a mounting substrate and a method of manufacturing the sameTOSHIBA KK·Filed 1997·Granted Jul 20, 1999·64 cites·9 claims
- 0683US6707160B2Semiconductor device using substrate having cubic structure and method of manufacturing the sameTOSHIBA KK·Filed 2001·Granted Mar 16, 2004·49 cites·33 claims
- 0783US5461197AElectronic device having a chip with an external bump terminal equal or smaller than a via hole on a boardTOSHIBA KK·Filed 1994·Granted Oct 24, 1995·72 cites·13 claims
- 0882US6171887B1Semiconductor device for a face down bonding to a mounting substrate and a method of manufacturing the sameTOSHIBA KK·Filed 1999·Granted Jan 9, 2001·55 cites·13 claims
- 0978US9345145B2Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using sameIWAI RYOTA·Filed 2010·Granted May 17, 2016·3 cites·13 claims
- 1076US4855807ASemiconductor deviceTOSHIBA KK·Filed 1987·Granted Aug 8, 1989·47 cites·7 claims
- 1175US8367468B2Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the sameNAT INST OF ADVANCED IND SCIEN·Filed 2011·Granted Feb 5, 2013·3 cites·11 claims
- 1274US5401688ASemiconductor device of multichip module-typeTOSHIBA KK·Filed 1993·Granted Mar 28, 1995·55 cites·7 claims
- 1365US5198883ASemiconductor device having an improved lead arrangement and method for manufacturing the sameTOSHIBA KK·Filed 1989·Granted Mar 30, 1993·35 cites·13 claims
- 1463US5567983ASemiconductor apparatus capable of cooling a semiconductor element with radiation efficiencyTOSHIBA KK·Filed 1995·Granted Oct 22, 1996·25 cites·2 claims
- 1562US8399979B2Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the sameYAMAJI YASUHIRO·Filed 2007·Granted Mar 19, 2013·3 cites·21 claims
- 1655US5548161ASemiconductor apparatus capable of cooling a semiconductor element with low radiation efficiencyTOSHIBA KK·Filed 1995·Granted Aug 20, 1996·18 cites·2 claims
- 1732US2013026650A1Semiconductor device, semiconductor module structure configured by vertically stacking semiconductor devices, and manufacturing method thereofYAMAGATA OSAMU·Filed 2012·Application pending·0 cites
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