Inventor · disambiguated record
Pin Chia Su
Also filed as: SU PIN CHIA
27 granted patents·4 pending applications·106 citations·filing 2002–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG17TAIWAN SEMICONDUCTOR MFG CO LTD11LU CHUNG-TSUNG1TAIWAN SEMICONDUCTOR MANFACTURING COMPANY LTD1YU TAI-YUNG1
Top patents by PatentIndex Score
31 records- 0196US12021130B2Circuit structure with gate configurationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·2 cites·20 claims
- 0296US11949000B2Metal gate structures and methods of fabricating the same in field-effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 2, 2024·3 cites·20 claims
- 0390US11588038B2Circuit structure with gate configurationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·2 cites·20 claims
- 0489US7588946B2Controlling system for gate formation of semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 15, 2009·29 cites·20 claims
- 0588US8816415B2Photodiode with concave reflectorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 26, 2014·4 cites·12 claims
- 0687US2025359276A1Circuit Structure with Gate ConfigurationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0783US12464801B2Circuit structure with gate configurationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0881US11502185B2Methods of manufacturing a gate electrode having metal layers with different average grain sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·1 cites·20 claims
- 0978US12507429B2Metal gate structures and methods of fabricating the same in field-effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 1078US2024363734A1P-Type FiNFET as a Radio-Frequency Device and Method Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1176US7995323B2Method and apparatus for securely dechucking wafersTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Aug 9, 2011·7 cites·33 claims
- 1275US12113120B2Gate electrode having a work-function layer including materials with different average grain sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 1374US7973293B2Implantation quality improvement by xenon/hydrogen dilution gasTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jul 5, 2011·6 cites·20 claims
- 1473US9142588B2Backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 22, 2015·2 cites·20 claims
- 1572US9240503B2Methods of manufacturing and using a photodiode with concave reflectorTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 19, 2016·0 cites·20 claims
- 1672US8416555B2System for securely dechucking wafersLU CHUNG-TSUNG·Filed 2011·Granted Apr 9, 2013·5 cites·20 claims
- 1771US8884390B2Backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MANFACTURING COMPANY LTD·Filed 2013·Granted Nov 11, 2014·2 cites·20 claims
- 1869US7018928B2Plasma treatment method to reduce silicon erosion over HDI silicon regionsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 28, 2006·12 cites·20 claims
- 1966US7910014B2Method and system for improving wet chemical bath process stability and productivity in semiconductor manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Mar 22, 2011·3 cites·20 claims
- 2066US6777334B2Method for protecting a wafer backside from etching damageTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 17, 2004·14 cites·15 claims
- 2162US8000081B2Method and apparatus for safely dechucking wafersTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Aug 16, 2011·2 cites·21 claims
- 2256US11476351B2Metal gate structures and methods of fabricating the same in field-effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 2355US6808589B2Wafer transfer robot having wafer blades equipped with sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 26, 2004·5 cites·10 claims
- 2453US9450014B2Backside illumination image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 20, 2016·0 cites·20 claims
- 2553US7306746B2Critical dimension control in a semiconductor fabrication processTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 11, 2007·6 cites·14 claims
- 2652US7851374B2Silicon wafer reclamation processTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 14, 2010·0 cites·9 claims
- 2750US2009233447A1Control wafer reclamation processTAIWAN SEMICONDUCTOR MFG·Filed 2008·Application pending·0 cites
- 2847US8049213B2Feature dimension measurementTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 1, 2011·0 cites·9 claims
- 2944US2011223767A1Control wafer reclamation processTAIWAN SEMICONDUCTOR MFG·Filed 2011·Application pending·0 cites
- 3040US8696930B2Silicon wafer reclamation processYU TAI-YUNG·Filed 2010·Granted Apr 15, 2014·0 cites·7 claims
- 3140US7101748B2Method of integrating the formation of a shallow junction N channel device with the formation of P channel, ESD and input/output devicesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 5, 2006·1 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →