Inventor · disambiguated record

Yoshinori Niwa

Also filed as: NIWA YOSHINORI

1 granted patent·4 citations·filing 2008–2008

24Inventor score

Technology areasH10W

Files withFUJITSU LTD1

Top patents by PatentIndex Score

1 record

0164US7646089B2Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic deviceFUJITSU LTD·Filed 2008·Granted Jan 12, 2010·4 cites·10 claims

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