Inventor · disambiguated record
Chung-Hsien Hsin
Also filed as: HSIN CHUNG H · HSIN CHUNG-HSIEN
38 granted patents·23 pending applications·234 citations·filing 2002–2020
97Inventor score
Top patents by PatentIndex Score
61 records- 0195US11309275B2Sensor package structureKINGPAK TECH INC·Filed 2020·Granted Apr 19, 2022·3 cites·8 claims
- 0292US8481343B2Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the sameHSIN CHUNG-HSIEN·Filed 2010·Granted Jul 9, 2013·20 cites·7 claims
- 0391US7554599B2Image sensor module with air escape hole and a method for manufacturing the sameKINGPAK TECH INC·Filed 2006·Granted Jun 30, 2009·17 cites·9 claims
- 0489US9905597B2Sensor package structureKINGPAK TECH INC·Filed 2017·Granted Feb 27, 2018·7 cites·13 claims
- 0589US8440488B2Manufacturing method and structure for wafer level image sensor module with fixed focal lengthTU HSIU-WEN·Filed 2010·Granted May 14, 2013·8 cites·4 claims
- 0689US7423334B2Image sensor module with a protection layer and a method for manufacturing the sameKINGPAK TECH INC·Filed 2005·Granted Sep 9, 2008·20 cites·2 claims
- 0785US10692917B2Sensor package structureKINGPAK TECH INC·Filed 2018·Granted Jun 23, 2020·5 cites·15 claims
- 0884US7598580B1Image sensor module package structure with supporting elementKINGPAK TECH INC·Filed 2008·Granted Oct 6, 2009·14 cites·15 claims
- 0982US8563350B2Wafer level image sensor packaging structure and manufacturing method for the sameTU HSIU-WEN·Filed 2010·Granted Oct 22, 2013·7 cites·16 claims
- 1079US8441086B2Image sensor packaging structure with predetermined focal lengthTU HSIU-WEN·Filed 2010·Granted May 14, 2013·6 cites·4 claims
- 1179US8390087B2Image sensor package structure with large air cavityTU HSIU-WEN·Filed 2010·Granted Mar 5, 2013·7 cites·13 claims
- 1279US6876544B2Image sensor module and method for manufacturing the sameKINGPAK TECH INC·Filed 2003·Granted Apr 5, 2005·17 cites·8 claims
- 1378US10170508B2Optical package structureKINGPAK TECH INC·Filed 2017·Granted Jan 1, 2019·4 cites·11 claims
- 1474US10720370B2Sensor package structureKINGPAK TECH INC·Filed 2018·Granted Jul 21, 2020·2 cites·7 claims
- 1573US8928104B2Image sensor packaging structure with black encapsulantTU HSIU-WEN·Filed 2010·Granted Jan 6, 2015·4 cites·12 claims
- 1672US10411055B2Sensor package structureKINGPAK TECH INC·Filed 2018·Granted Sep 10, 2019·2 cites·11 claims
- 1772US6933493B2Image sensor having a photosensitive chip mounted to a metal sheetKINGPAK TECH INC·Filed 2003·Granted Aug 23, 2005·18 cites·4 claims
- 1872US6740973B1Stacked structure for an image sensorKINGPAK TECH INC·Filed 2003·Granted May 25, 2004·16 cites·6 claims
- 1970US8093674B2Manufacturing method for molding image sensor package structure and image sensor package structure thereofTU HSIU-WEN·Filed 2009·Granted Jan 10, 2012·5 cites·11 claims
- 2068US6874227B2Method for packaging an image sensorKINGPAK TECH INC·Filed 2003·Granted Apr 5, 2005·17 cites·4 claims
- 2167US8847146B2Image sensor package structure with casing including a vent without sealing and in communication with package materialTU HSIU-WEN·Filed 2009·Granted Sep 30, 2014·4 cites·7 claims
- 2266US10236313B2Sensor package structureKINGPAK TECH INC·Filed 2017·Granted Mar 19, 2019·1 cites·5 claims
- 2366US10186538B2Sensor package structureKINGPAK TECH INC·Filed 2017·Granted Jan 22, 2019·1 cites·14 claims
- 2466US7368795B2Image sensor module with passive componentKINGPAK TECH INC·Filed 2005·Granted May 6, 2008·3 cites·2 claims
- 2560US7196322B1Image sensor packageKINGPAK TECH INC·Filed 2004·Granted Mar 27, 2007·10 cites·5 claims
- 2659US9184331B2Method for reducing tilt of optical unit during manufacture of image sensorKINGPAK TECH INC·Filed 2013·Granted Nov 10, 2015·1 cites·20 claims
- 2757US8004602B2Image sensor structure and integrated lens module thereofKINGPAK TECH INC·Filed 2008·Granted Aug 23, 2011·1 cites·15 claims
- 2853US7511261B2Image sensor module structure with lens holder having vertical inner and outer sidewallsHSIN CHUNG HSIEN·Filed 2004·Granted Mar 31, 2009·9 cites·2 claims
- 2952US7064404B1Image sensor structureKINGPAK TECH INC·Filed 2005·Granted Jun 20, 2006·1 cites·4 claims
- 3051US6791842B2Image sensor structureKINGPAK TECH INC·Filed 2002·Granted Sep 14, 2004·4 cites·4 claims
- 3145US8828777B2Wafer level image sensor packaging structure and manufacturing method of the sameTU HSIU-WEN·Filed 2011·Granted Sep 9, 2014·0 cites·16 claims
- 3245US8378441B2Manufacturing method and structure of a wafer level image sensor module with package structureKINGPAK TECH INC·Filed 2011·Granted Feb 19, 2013·0 cites·20 claims
- 3345US2007138585A1Image sensor packageHSIN CHUNG H·Filed 2005·Application pending·0 cites
- 3444US7402839B2Image sensor package structureKINGPAK TECH INC·Filed 2006·Granted Jul 22, 2008·0 cites·3 claims
- 3544US7268346B2Method of disassembling an image sensor packageKINGPAK TECH INC·Filed 2005·Granted Sep 11, 2007·0 cites·2 claims
- 3644US2007159543A1Simplified image sensor module packageHSIN CHUNG H·Filed 2005·Application pending·0 cites
- 3744US2009045476A1Image sensor package and method for forming the sameKINGPAK TECH INC·Filed 2007·Application pending·0 cites
- 3843US2008067334A1Image sensor package structure and method for manufacturing the sameCHUANG JASON·Filed 2007·Application pending·0 cites
- 3942US2008036025A1Image sensor packageHSIN CHUNG H·Filed 2007·Application pending·0 cites
- 4041US2007210434A1Structure of stacked integrated circuits and method for manufacturing the sameHSIN CHUNG H·Filed 2006·Application pending·0 cites
- 4140US10600830B2Sensor package structureKINGPAK TECH INC·Filed 2017·Granted Mar 24, 2020·0 cites·9 claims
- 4240US2007241272A1Image sensor package structure and method for manufacturing the sameCHUANG JASON·Filed 2006·Application pending·0 cites
- 4340US2007096280A1Image sensor module structure and a method for manufacturing the sameTU HSIU W·Filed 2005·Application pending·0 cites
- 4440US2007090380A1Image sensor structure with a connectorHSIN CHUNG H·Filed 2005·Application pending·0 cites
- 4539US2006175694A1Stacked structure of integrated circuits and method for manufacturing the sameHSIN CHUNG H·Filed 2005·Application pending·0 cites
- 4639US2006197201A1Image sensor structureHSIN CHUNG H·Filed 2005·Application pending·0 cites
- 4739US2007138586A1Image sensor module packageHSIN CHUNG H·Filed 2005·Application pending·0 cites
- 4838US7440263B2Image sensor and method for manufacturing the sameKINGPAK TECH INC·Filed 2003·Granted Oct 21, 2008·0 cites·6 claims
- 4938US2005077620A1Miniaturized small memory card structureFiled 2003·Application pending·0 cites
- 5037US2004150061A1Package structure of a photosensorFiled 2003·Application pending·0 cites
Showing the top 50 of 61 patent records by PatentIndex Score.
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