Inventor · disambiguated record
Mon Ho
Also filed as: HO MON N · HO MON NAN
13 granted patents·18 pending applications·276 citations·filing 2000–2022
92Inventor score
Top patents by PatentIndex Score
31 records- 0191US7554599B2Image sensor module with air escape hole and a method for manufacturing the sameKINGPAK TECH INC·Filed 2006·Granted Jun 30, 2009·17 cites·9 claims
- 0289US7423334B2Image sensor module with a protection layer and a method for manufacturing the sameKINGPAK TECH INC·Filed 2005·Granted Sep 9, 2008·20 cites·2 claims
- 0387US6521881B2Stacked structure of an image sensor and method for manufacturing the sameKINGPAK TECH INC·Filed 2001·Granted Feb 18, 2003·53 cites·15 claims
- 0486US6559539B2Stacked package structure of image sensorFiled 2001·Granted May 6, 2003·55 cites·10 claims
- 0583US6590269B1Package structure for a photosensitive chipKINGPAK TECH INC·Filed 2002·Granted Jul 8, 2003·46 cites·2 claims
- 0682US6627983B2Stacked package structure of image sensorFiled 2001·Granted Sep 30, 2003·43 cites·12 claims
- 0773US6737720B2Packaging structure of image sensor and method for packaging the sameFiled 2001·Granted May 18, 2004·22 cites·11 claims
- 0870US8093674B2Manufacturing method for molding image sensor package structure and image sensor package structure thereofTU HSIU-WEN·Filed 2009·Granted Jan 10, 2012·5 cites·11 claims
- 0967US8847146B2Image sensor package structure with casing including a vent without sealing and in communication with package materialTU HSIU-WEN·Filed 2009·Granted Sep 30, 2014·4 cites·7 claims
- 1059US12048228B2Image capture deviceGINGY TECHNOLOGY INC·Filed 2021·Granted Jul 23, 2024·0 cites·8 claims
- 1156US6489572B2Substrate structure for an integrated circuit package and method for manufacturing the sameKINGPAK TECH INC·Filed 2001·Granted Dec 3, 2002·8 cites·12 claims
- 1254US11783621B2Optical fingerprint imaging deviceGINGY TECHNOLOGY INC·Filed 2022·Granted Oct 10, 2023·0 cites·19 claims
- 1346US2020381470A1Image capture deviceGINGY TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 1445US6565008B2Module card and a method for manufacturing the sameKINGPAK TECH INC·Filed 2000·Granted May 20, 2003·3 cites·10 claims
- 1545US2007138585A1Image sensor packageHSIN CHUNG H·Filed 2005·Application pending·0 cites
- 1643US2008067334A1Image sensor package structure and method for manufacturing the sameCHUANG JASON·Filed 2007·Application pending·0 cites
- 1742US2008036025A1Image sensor packageHSIN CHUNG H·Filed 2007·Application pending·0 cites
- 1840US2007241272A1Image sensor package structure and method for manufacturing the sameCHUANG JASON·Filed 2006·Application pending·0 cites
- 1940US2007096280A1Image sensor module structure and a method for manufacturing the sameTU HSIU W·Filed 2005·Application pending·0 cites
- 2040US2007108544A1Image sensor with a compound structureTU HSIU W·Filed 2005·Application pending·0 cites
- 2139US2007138586A1Image sensor module packageHSIN CHUNG H·Filed 2005·Application pending·0 cites
- 2234US2003116846A1Stacked structure of a ball grid array (BGA) integrated circuit packageFiled 2001·Application pending·0 cites
- 2333US2002060287A1Structure of a photosensor and method for packaging the sameFiled 2001·Application pending·0 cites
- 2432US2015214416A1Method of package for sensor chipSTACK DEVICES CORP·Filed 2014·Application pending·0 cites
- 2532US2003116817A1Image sensor structureFiled 2001·Application pending·0 cites
- 2632US2002043709A1Stackable integrated circuitFiled 2001·Application pending·0 cites
- 2731US2002096729A1Stacked package structure of image sensorFiled 2001·Application pending·0 cites
- 2830US2014170796A1Image sensor packaging methodSTACK DEVICES CORP·Filed 2012·Application pending·0 cites
- 2930US2002096763A1Packaging structure of image sensors and method for packaging the sameFiled 2001·Application pending·0 cites
- 3030US2014170797A1Sensor chip protective image sensor packaging methodSTACK DEVICES CORP·Filed 2012·Application pending·0 cites
- 3127US2002096747A1Package structure of an integrated circuitFiled 2001·Application pending·0 cites
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