Inventor · disambiguated record
Kiyotaka Tsukada
Also filed as: TSUKADA KIYOTAKA
49 granted patents·4 pending applications·1,494 citations·filing 1983–2024
99Inventor score
Top patents by PatentIndex Score
53 records- 0198US6228466B1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1998·Granted May 8, 2001·238 cites·20 claims
- 0297US8148643B2Multilayered printed circuit board and manufacturing method thereofHIROSE NAOHIRO·Filed 2007·Granted Apr 3, 2012·56 cites·10 claims
- 0397US6591495B2Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic platingIBIDEN CO LTD·Filed 2001·Granted Jul 15, 2003·102 cites·5 claims
- 0496US4777152APorous silicon carbide sinter and its productionIBIDEN CO LTD·Filed 1988·Granted Oct 11, 1988·87 cites·5 claims
- 0595US4993481AThermal storage unitAGENCY IND SCIENCE TECHN·Filed 1989·Granted Feb 19, 1991·123 cites·19 claims
- 0694US6715204B1Printed wiring board and method for producing the sameIBIDEN CO LTD·Filed 1999·Granted Apr 6, 2004·110 cites·12 claims
- 0793US7612295B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2006·Granted Nov 3, 2009·26 cites·4 claims
- 0892US6809415B2Printed-circuit board and method of manufacture thereofIBIDEN CO LTD·Filed 2000·Granted Oct 26, 2004·80 cites·11 claims
- 0991US7415761B2Method of manufacturing multilayered circuit boardIBIDEN CO LTD·Filed 2003·Granted Aug 26, 2008·35 cites·9 claims
- 1089US6590165B1Printed wiring board having throughole and annular landsIBIDEN CO LTD·Filed 1998·Granted Jul 8, 2003·99 cites·5 claims
- 1188US12295371B2Antiviral substrate, antiviral composition, method for manufacturing antiviral substrate, antimicrobial substrate, antimicrobial composition and method for manufacturing antimicrobial substrateIBIDEN CO LTD·Filed 2024·Granted May 13, 2025·0 cites·12 claims
- 1287US7832098B2Method of manufacturing a multilayered printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Nov 16, 2010·10 cites·10 claims
- 1387US7568922B2Printed wiring board having a solder pad and a method for manufacturing the sameIBIDEN CO LTD·Filed 2005·Granted Aug 4, 2009·17 cites·17 claims
- 1486US6358630B1Soldering member for printed wiring boardsIBIDEN CO LTD·Filed 1998·Granted Mar 19, 2002·64 cites·4 claims
- 1584US11517020B2Antiviral substrate, antiviral composition, method for manufacturing antiviral substrate, antimicrobial substrate, antimicrobial composition and method for manufacturing antimicrobial substrateIBIDEN CO LTD·Filed 2020·Granted Dec 6, 2022·1 cites·13 claims
- 1684US6555208B2Printed wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 2001·Granted Apr 29, 2003·27 cites·14 claims
- 1782US4485182APowder composition for producing sintered ceramicIBIDEN CO LTD·Filed 1983·Granted Nov 27, 1984·28 cites·6 claims
- 1881US7312401B2Flexible printed wiring boardIBIDEN CO LTD·Filed 2005·Granted Dec 25, 2007·13 cites·10 claims
- 1980US11925180B2Antiviral substrate, antiviral composition, method for manufacturing antiviral substrate, antimicrobial substrate, antimicrobial composition and method for manufacturing antimicrobial substrateIBIDEN CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·28 claims
- 2080US7943861B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2005·Granted May 17, 2011·10 cites·21 claims
- 2179US8441806B2Circuit board and semiconductor moduleTSUKADA KIYOTAKA·Filed 2010·Granted May 14, 2013·6 cites·33 claims
- 2278US5144536AElectronic circuit substrateIBIDEN CO LTD·Filed 1990·Granted Sep 1, 1992·58 cites·22 claims
- 2378US4932438AValve provided with valve bodies made of a ceramic compoundKITAMURA VALVE KK·Filed 1989·Granted Jun 12, 1990·33 cites·10 claims
- 2477US7552531B2Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuitIBIDEN CO LTD·Filed 2003·Granted Jun 30, 2009·22 cites·5 claims
- 2577US6284353B1Printed wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 1999·Granted Sep 4, 2001·35 cites·4 claims
- 2676US7786389B2Flexible printed wiring boardIBIDEN CO LTD·Filed 2007·Granted Aug 31, 2010·8 cites·20 claims
- 2776US6232558B1Electronic component mounting base board having heat slug with slits and projectionsIBIDEN CO LTD·Filed 1998·Granted May 15, 2001·53 cites·7 claims
- 2875US5114886AUnique ceramic compoundIBIDEN CO LTD·Filed 1990·Granted May 19, 1992·27 cites·5 claims
- 2970US8415791B2Semiconductor device and fabrication method thereforTSUKADA KIYOTAKA·Filed 2010·Granted Apr 9, 2013·4 cites·20 claims
- 3067US9781840B2Substrate for mounting electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Oct 3, 2017·2 cites·20 claims
- 3167US7765692B2Method of manufacturing printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Aug 3, 2010·2 cites·4 claims
- 3265US8156646B2Method for manufacturing printed wiring boardIWAI TSUTOMU·Filed 2009·Granted Apr 17, 2012·4 cites·10 claims
- 3365US6986917B2Printed wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 2003·Granted Jan 17, 2006·8 cites·10 claims
- 3464US4540677AProcess for producing a power composition for producing sintered ceramic articlesIBIDEN CO LTD·Filed 1984·Granted Sep 10, 1985·15 cites·10 claims
- 3562US7594320B2Method of manufacturing printed wiring boardIBIDEN CO LTD·Filed 2005·Granted Sep 29, 2009·1 cites·13 claims
- 3662US5914859AElectronic component mounting base board and method of producing the sameIBIDEN CO LTD·Filed 1997·Granted Jun 22, 1999·22 cites·12 claims
- 3761US7453702B2Printed wiring boardIBIDEN CO LTD·Filed 2005·Granted Nov 18, 2008·3 cites·13 claims
- 3860US8378231B2Semiconductor device and method for manufacturing the sameIBIDEN CO LTD·Filed 2009·Granted Feb 19, 2013·2 cites·23 claims
- 3955US8710374B2Printed wiring board with reinforced insulation layer and manufacturing method thereofTSUKADA KIYOTAKA·Filed 2009·Granted Apr 29, 2014·1 cites·21 claims
- 4055US7339118B1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1998·Granted Mar 4, 2008·18 cites·9 claims
- 4153US4913738AHeat-resistant composite bodyIBIDEN CO LTD·Filed 1989·Granted Apr 3, 1990·10 cites·6 claims
- 4252US2012125680A1Multilayered printed circuit board and manufacturing method thereofHIROSE NAOHIRO·Filed 2012·Application pending·0 cites
- 4351US4537735AMethod of producing a silicon carbide sintered compactIBIDEN CO LTD·Filed 1983·Granted Aug 27, 1985·11 cites·4 claims
- 4449US7310238B2Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Dec 18, 2007·0 cites·19 claims
- 4548US8327533B2Printed wiring board with resin complex layer and manufacturing method thereofTSUKADA KIYOTAKA·Filed 2009·Granted Dec 11, 2012·0 cites·22 claims
- 4643US6455783B1Multilayer printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1998·Granted Sep 24, 2002·11 cites·15 claims
- 4739US10319892B2Light-emitting element mounting substrate and method for manufacturing light-emitting element mounting substrateIBIDEN CO LTD·Filed 2018·Granted Jun 11, 2019·0 cites·20 claims
- 4839US2017223816A1Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring boardIBIDEN CO LTD·Filed 2017·Application pending·0 cites
- 4938US8278753B2Semiconductor device and production method thereofTSUKADA KIYOTAKA·Filed 2010·Granted Oct 2, 2012·0 cites·11 claims
- 5037US4846673AProcess for preparing heat-resistant composite bodyIBIDEN CO LTD·Filed 1988·Granted Jul 11, 1989·4 cites·9 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →