Inventor · disambiguated record
Chee Hong Lee
Also filed as: LEE CHEE HONG
8 granted patents·11 pending applications·46 citations·filing 2005–2024
80Inventor score
Top patents by PatentIndex Score
19 records- 0188US7553172B2USB connectorTHOMSON LICENSING·Filed 2005·Granted Jun 30, 2009·38 cites·5 claims
- 0268US10777536B2Semiconductor package with air cavityINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 15, 2020·2 cites·22 claims
- 0360US2025062273A1Package with Vertical Electronic Components Held Together by a ClipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0460US2024343553A1Semiconductor package with floating metal portion and method for manufacturingINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0559US2025226297A1Package with carrier having plated bottom surface and sidewallINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0658US7758359B2USB connectorTHOMSON LICENSING·Filed 2009·Granted Jul 20, 2010·6 cites·6 claims
- 0757US2025140729A1Molded power package with vertical interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0857US2025140734A1Molded power die package with vertical interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0956US2024312936A1Power semiconductor package including a passive electronic component and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1055US11274984B2Pressure sensor having a lidless/laminate structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 15, 2022·0 cites·16 claims
- 1154US11984392B2Semiconductor package having a chip carrier with a pad offset featureINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 1252US12176222B2Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
- 1351US2024006260A1Encapsulated package with exposed electrically conductive structures and sidewall recessINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1450US11289436B2Semiconductor package having a laser-activatable mold compoundINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Mar 29, 2022·0 cites·13 claims
- 1550US2022375883A1Method for Fabricating an Electrical Device Package Comprising Plateable Encapsulating LayersINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1649US2022278085A1Method for connecting an electrical device to a bottom unit by using a solderless jointINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1749US2024312956A1Subtractive Metal Structuring on Surface of Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1847US11791169B2Dual step laser processing of an encapsulant of a semiconductor chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 17, 2023·0 cites·21 claims
- 1940US2021313294A1Semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →