Inventor · disambiguated record
Chan Lam Cha
Also filed as: CHA CHAN LAM
8 granted patents·8 pending applications·7 citations·filing 2015–2025
77Inventor score
Top patents by PatentIndex Score
16 records- 0181US11081455B2Semiconductor device with bond pad extensions formed on molded appendageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Aug 3, 2021·4 cites·14 claims
- 0280US11469161B2Lead frame-based semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 11, 2022·1 cites·23 claims
- 0366US12278171B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted Apr 15, 2025·0 cites·17 claims
- 0465US2025210478A1Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0564US10396018B2Multi-phase half bridge driver package and methods of manufactureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·1 cites·13 claims
- 0664US2025266311A1Methods for Manufacturing Semiconductor PackagesINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0759US12300559B2Semiconductor packages and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·15 claims
- 0857US11217511B2Quad package with conductive clips connected to terminals at upper surface of semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 4, 2022·1 cites·27 claims
- 0957US2023197585A1Semiconductor package interconnect and power connection by metallized structures on package bodyINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 1057US2025140734A1Molded power die package with vertical interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1155US11274984B2Pressure sensor having a lidless/laminate structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 15, 2022·0 cites·16 claims
- 1252US12176222B2Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 24, 2024·0 cites·20 claims
- 1349US2022278085A1Method for connecting an electrical device to a bottom unit by using a solderless jointINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1449US2025385220A1Method of forming an electrical connection and electrical connectionINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1544US2023170329A1Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1630US2017011989A1Lead frame including u-notchINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →