Inventor · disambiguated record
Hong Lim Lee
Also filed as: LEE HONG LIM
5 granted patents·20 citations·filing 2002–2018
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0173US7045455B2Via electromigration improvement by changing the via bottom geometric profileCHARTERED SEMICONDUCTOR MFG·Filed 2003·Granted May 16, 2006·17 cites·14 claims
- 0259US7781895B2Via electromigration improvement by changing the via bottom geometric profileCHARTERED SEMICONDUCTOR MFG·Filed 2009·Granted Aug 24, 2010·1 cites·12 claims
- 0348US7691739B2Via electromigration improvement by changing the via bottom geometric profileCHARTERED SEMICONDUCTOR MFG·Filed 2006·Granted Apr 6, 2010·0 cites·12 claims
- 0446US10457001B2Method for forming a matrix composite layer and workpiece with a matrix composite layerINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 29, 2019·0 cites·30 claims
- 0536US6765296B2Via-sea layout integrated circuitsCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Jul 20, 2004·2 cites·14 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →