Inventor · disambiguated record
Atsuhito Hayakawa
Also filed as: HAYAKAWA ATSUHITO
8 granted patents·1 pending application·94 citations·filing 1995–2007
85Inventor score
Top patents by PatentIndex Score
9 records- 0168US5739186AEpoxy resin composition for semiconductor encapsulationSHELL OIL CO·Filed 1995·Granted Apr 14, 1998·40 cites·7 claims
- 0257US7491774B2Producing granular epoxy resin by refining and pulverizing solid epoxy resinJAPAN EPOXY RESINS CO LTD·Filed 2007·Granted Feb 17, 2009·0 cites·2 claims
- 0357US7307128B2Epoxy compound, preparation method thereof, and use thereofJAPAN EPOXY RESINS CO LTD·Filed 2004·Granted Dec 11, 2007·7 cites·11 claims
- 0457US7304120B2Epoxy compound, preparation method thereof, and use thereofJAPAN EPOXY RESINS CO LTD·Filed 2007·Granted Dec 4, 2007·1 cites·7 claims
- 0556US6255365B1Epoxy resin composition for semiconductor encapsulationSHELL OIL CO·Filed 1999·Granted Jul 3, 2001·23 cites·19 claims
- 0656US6063876AEpoxy resin composition and epoxy resin composition for encapsulating semiconductorsSHELL OIL CO·Filed 1998·Granted May 16, 2000·22 cites·8 claims
- 0745US7285602B2Granular epoxy resin, production method thereof, and granular epoxy resin packageJAPAN EPOXY RESINS CO LTD·Filed 2004·Granted Oct 23, 2007·0 cites·6 claims
- 0843US6881799B2Curing agent for epoxy resins and epoxy resin compositionRESOLUTION PERFORMANCE PRODUCT·Filed 2002·Granted Apr 19, 2005·1 cites·7 claims
- 0934US2004048971A1Epoxy resin composition for semiconductor encapsulationFiled 2002·Application pending·0 cites
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