Inventor · disambiguated record
Haruhiko Matsuyama
Also filed as: MATSUYAMA HARUHIKO
17 granted patents·452 citations·filing 1983–1999
95Inventor score
Files withHITACHI LTD17
Top patents by PatentIndex Score
17 records- 0190US4748228AProcess for producing organic silicon-terminated polyimide precursor and polyimideHITACHI LTD·Filed 1986·Granted May 31, 1988·55 cites·12 claims
- 0285US5868949AMetalization structure and manufacturing method thereofHITACHI LTD·Filed 1995·Granted Feb 9, 1999·93 cites·36 claims
- 0384US4486232AElectrode material for semi-conductor devicesHITACHI LTD·Filed 1983·Granted Dec 4, 1984·47 cites·3 claims
- 0483US5388328AProcess for fabricating an interconnected multilayer boardHITACHI LTD·Filed 1994·Granted Feb 14, 1995·69 cites·64 claims
- 0582US4643913AProcess for producing solar cellsHITACHI LTD·Filed 1984·Granted Feb 17, 1987·48 cites·26 claims
- 0674US5300735AInterconnected multilayer boards and fabrication processes thereofHITACHI LTD·Filed 1993·Granted Apr 5, 1994·42 cites·25 claims
- 0768US4686147AMagnetic head and method of producing the sameHITACHI LTD·Filed 1986·Granted Aug 11, 1987·18 cites·6 claims
- 0853US5208656AMultilayer wiring substrate and production thereofHITACHI LTD·Filed 1991·Granted May 4, 1993·23 cites·17 claims
- 0951US4824731AThin film magnetic headHITACHI LTD·Filed 1988·Granted Apr 25, 1989·8 cites·17 claims
- 1048US6124553AMultilayer wiring board having vent holes and method of makingHITACHI LTD·Filed 1994·Granted Sep 26, 2000·17 cites·4 claims
- 1142US5958600ACircuit board and method of manufacturing the sameHITACHI LTD·Filed 1996·Granted Sep 28, 1999·11 cites·23 claims
- 1234US5851681AWiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring boardHITACHI LTD·Filed 1994·Granted Dec 22, 1998·8 cites·14 claims
- 1332US5970310AMethod for manufacturing multilayer wiring board and wiring pattern forming apparatusHITACHI LTD·Filed 1997·Granted Oct 19, 1999·8 cites·15 claims
- 1430US6132852AMultilayer wiring substrate and method for production thereofHITACHI LTD·Filed 1999·Granted Oct 17, 2000·0 cites·12 claims
- 1530US5753372AWiring structures and method of manufacturing the sameHITACHI LTD·Filed 1995·Granted May 19, 1998·3 cites·35 claims
- 1630US4772505AMagnetic bubble memory elementHITACHI LTD·Filed 1986·Granted Sep 20, 1988·1 cites·9 claims
- 1729US5280102AHeat-resistant bonding materialsHITACHI LTD·Filed 1990·Granted Jan 18, 1994·1 cites·14 claims
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