Inventor · disambiguated record
Tatsuo Hirasawa
Also filed as: HIRASAWA TATSUO
10 granted patents·1 pending application·5 citations·filing 2013–2021
78Inventor score
Files withTOKYO ELECTRON LTD11
Top patents by PatentIndex Score
11 records- 0185US10309005B2Deposition device and deposition methodTOKYO ELECTRON LTD·Filed 2014·Granted Jun 4, 2019·3 cites·19 claims
- 0271US10189230B2Method for forming copper filmTOKYO ELECTRON LTD·Filed 2017·Granted Jan 29, 2019·1 cites·5 claims
- 0363US9406558B2Cu wiring fabrication method and storage mediumTOKYO ELECTRON LTD·Filed 2015·Granted Aug 2, 2016·1 cites·8 claims
- 0460US11742190B2Sputtering apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2021·Granted Aug 29, 2023·0 cites·12 claims
- 0558US12014911B2Sputtering apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jun 18, 2024·0 cites·7 claims
- 0649US12027353B2Substrate processing method and apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jul 2, 2024·0 cites·4 claims
- 0748US11479848B2Film forming apparatus and methodTOKYO ELECTRON LTD·Filed 2021·Granted Oct 25, 2022·0 cites·14 claims
- 0845US9406557B2Copper wiring forming method with Ru liner and Cu alloy fillTOKYO ELECTRON LTD·Filed 2014·Granted Aug 2, 2016·0 cites·8 claims
- 0943US11158492B2Film forming apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2019·Granted Oct 26, 2021·0 cites·18 claims
- 1042US9253862B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Feb 2, 2016·0 cites·10 claims
- 1133US2015240344A1Ruthenium film forming method, ruthenium film forming apparatus, and semiconductor device manufacturing methodTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →