Inventor · disambiguated record
Atsushi Fujisaki
Also filed as: FUJISAKI ATSUSHI
28 granted patents·10 pending applications·91 citations·filing 2000–2025
94Inventor score
Top patents by PatentIndex Score
38 records- 0193US11742271B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·4 cites·20 claims
- 0291US10325869B2Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 18, 2019·6 cites·20 claims
- 0391US9728490B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 8, 2017·9 cites·16 claims
- 0489US9735090B2Integrated circuit devices having through-silicon vias and methods of manufacturing such devicesCHOI JU-IL·Filed 2015·Granted Aug 15, 2017·10 cites·20 claims
- 0589US6351686B1Semiconductor device manufacturing apparatus and control method thereofMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 26, 2002·53 cites·10 claims
- 0682US10580726B2Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 3, 2020·3 cites·20 claims
- 0781US11538783B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·1 cites·20 claims
- 0881US11302660B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 12, 2022·1 cites·19 claims
- 0980US11004814B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 1079US12354987B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 1178US12040294B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1277US12424572B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1377US2025323221A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1476US2025343111A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1575US2025105116A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1674US11694978B2Semiconductor devices and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 1773US11984420B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 1873US2025014958A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1971US12014972B2Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·13 claims
- 2070US11728297B2Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 2170US10763163B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 1, 2020·1 cites·19 claims
- 2269US11581279B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 2366US12355005B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·19 claims
- 2465US12381130B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·19 claims
- 2565US12183664B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·17 claims
- 2664US10020273B2Semiconductor devices and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 10, 2018·1 cites·20 claims
- 2762US11488860B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·23 claims
- 2860US11018101B2Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 2957US12142541B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 12, 2024·0 cites·20 claims
- 3057US11094612B2Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 17, 2021·0 cites·15 claims
- 3154US2023026211A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3252US2023042063A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3350US2023038603A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3448US11444014B2Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·18 claims
- 3548US2016086874A1Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devicesCHOI JU-IL·Filed 2015·Application pending·0 cites
- 3645US10872869B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·18 claims
- 3741US2017051424A1Shielding Unit and Plating Apparatus Including the SameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 3833US2003081394A1Electronic-part mounting structure and mounting method thereforFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →