Inventor · disambiguated record
Teakhoon Lee
Also filed as: LEE TEAKHOON
13 granted patents·6 pending applications·17 citations·filing 2012–2025
85Inventor score
Top patents by PatentIndex Score
19 records- 0191US12176313B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 24, 2024·2 cites·14 claims
- 0290US11462462B2Semiconductor packages including a recessed conductive postSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 4, 2022·3 cites·19 claims
- 0386US11705323B2Wafer trimming deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 0485US9245787B2Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the sameJEON CHANG-SEONG·Filed 2012·Granted Jan 26, 2016·10 cites·18 claims
- 0574US11967581B2Package structures having underfillsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 23, 2024·0 cites·20 claims
- 0673US2025300137A1Semiconductor chip and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0773US2025079378A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0871US2024203945A1Semiconductor package including mold layer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0969US12237240B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·18 claims
- 1069US11791308B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 1166US11587906B2Package structures having underfillsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 1265US2025167061A1Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1364US12355004B2Semiconductor chip and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 1462US11923340B2Semiconductor package including mold layer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 1562US11362062B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 14, 2022·0 cites·20 claims
- 1652US2023121888A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1747US12218096B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 1847US11791282B2Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·16 claims
- 1932US2016086912A1Methods for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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