Inventor · disambiguated record
Hyoung Il Kim
Also filed as: KIM HYOUNG IL
56 granted patents·25 pending applications·130 citations·filing 2002–2022
97Inventor score
Top patents by PatentIndex Score
81 records- 0194US10393799B2Electronic device packageINTEL CORP·Filed 2017·Granted Aug 27, 2019·10 cites·21 claims
- 0289US11990449B2Dual RDL stacked die package using vertical wireINTEL CORP·Filed 2019·Granted May 21, 2024·6 cites·10 claims
- 0386US10120424B2Conductive stress-relief washers in microelectronic assembliesINTEL CORP·Filed 2017·Granted Nov 6, 2018·4 cites·16 claims
- 0486US9143917B2Bluetooth communication method and terminal adopting sameKIM BO-MIN·Filed 2010·Granted Sep 22, 2015·9 cites·23 claims
- 0586US9071699B2Apparatus and method for automatic call receiving and sending depending on user posture in portable terminalSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 30, 2015·4 cites·17 claims
- 0685US10425524B2Apparatus and method for automatic call receiving and sending depending on user posture in portable terminalSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 24, 2019·2 cites·20 claims
- 0785US8768325B2Apparatus and method for automatic call receiving and sending depending on user posture in portable terminalKIM HYOUNG-IL·Filed 2010·Granted Jul 1, 2014·6 cites·20 claims
- 0883US10038776B2Apparatus and method for automatic call receiving and sending depending on user posture in portable terminalSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 31, 2018·2 cites·14 claims
- 0983US9292191B2Apparatus and method for determining user input pattern in portable terminalKIM HYOUNG-IL·Filed 2010·Granted Mar 22, 2016·9 cites·14 claims
- 1081US11145632B2High density die package configuration on system boardsINTEL CORP·Filed 2017·Granted Oct 12, 2021·3 cites·20 claims
- 1178US7478894B2Method of calibrating print alignment errorSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 20, 2009·20 cites·5 claims
- 1275US10373545B2Frame rate control method and electronic device thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 6, 2019·2 cites·7 claims
- 1374US10217435B2Electronic device for displaying screen and method of controlling sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 26, 2019·2 cites·14 claims
- 1472US10727220B2Package on package with integrated passive electronics method and apparatusINTEL CORP·Filed 2019·Granted Jul 28, 2020·1 cites·13 claims
- 1570US12046581B2Integrated circuit package with glass spacerINTEL CORP·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 1670US11545464B2Diode for use in testing semiconductor packagesINTEL CORP·Filed 2018·Granted Jan 3, 2023·1 cites·18 claims
- 1770US11251111B2Leadframe in packages of integrated circuitsINTEL CORP·Filed 2017·Granted Feb 15, 2022·1 cites·20 claims
- 1869US8471517B2Motor controlling apparatus and motor controlling method thereofKIM TAE-YOUNG·Filed 2010·Granted Jun 25, 2013·2 cites·15 claims
- 1968US10790257B2Active package substrate having anisotropic conductive layerINTEL CORP·Filed 2016·Granted Sep 29, 2020·1 cites·20 claims
- 2068US2023227686A1Automotive hydraulic transfer paint composition and coated products and parts for automobiles including sameHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 2167US11694987B2Active package substrate having anisotropic conductive layerINTEL CORP·Filed 2020·Granted Jul 4, 2023·0 cites·22 claims
- 2267US9503002B2Image forming apparatus, motor control apparatus, and method of controlling motorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 22, 2016·2 cites·16 claims
- 2367US7417657B2Thermal printer and printing methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 26, 2008·3 cites·12 claims
- 2466US10181456B2Multi-package integrated circuit assembly with package on package interconnectsINTEL CORP·Filed 2017·Granted Jan 15, 2019·1 cites·14 claims
- 2566US8773726B2Image forming device capable of controlling scanning unit and method to control scanning unit thereofKIM HYOUNG-IL·Filed 2007·Granted Jul 8, 2014·2 cites·33 claims
- 2666US8598830B2Image forming apparatus, motor control apparatus and motor control method thereofKIM HYOUNG-IL·Filed 2011·Granted Dec 3, 2013·2 cites·19 claims
- 2765US10863017B2Apparatus and method for automatic call receiving and sending depending on user posture in portable terminalSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 2865US8508815B2ScannerKIM HYOUNG IL·Filed 2009·Granted Aug 13, 2013·5 cites·17 claims
- 2964US10847450B2Compact wirebonding in stacked-chip system in package, and methods of making sameINTEL CORP·Filed 2016·Granted Nov 24, 2020·1 cites·9 claims
- 3063US9864443B2Method for controlling user input and electronic device thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 9, 2018·1 cites·18 claims
- 3163US7083251B2Method of compensating sheet feeding errors in ink-jet printerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 1, 2006·9 cites·10 claims
- 3262US6984956B2Method of driving step motorSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 10, 2006·12 cites·18 claims
- 3359US7262786B2Image aligning method for thermal imaging printerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 28, 2007·7 cites·13 claims
- 3457US10573575B2Semiconductor package with thermal finsINTEL CORP·Filed 2017·Granted Feb 25, 2020·0 cites·24 claims
- 3556US9521242B2Apparatus and method for automatic call receiving and sending depending on user posture in portable terminalSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 13, 2016·0 cites·15 claims
- 3652US11637045B2Anisotropic conductive film (ACF) for use in testing semiconductor packagesINTEL CORP·Filed 2019·Granted Apr 25, 2023·0 cites·18 claims
- 3752US11393788B2Integrated circuit package with glass spacerINTEL CORP·Filed 2016·Granted Jul 19, 2022·0 cites·12 claims
- 3851US11658079B2Temporary interconnect for use in testing a semiconductor packageINTEL CORP·Filed 2019·Granted May 23, 2023·0 cites·25 claims
- 3951US10446533B2Package on package with integrated passive electronics method and apparatusINTEL CORP·Filed 2017·Granted Oct 15, 2019·0 cites·9 claims
- 4050US9954468B2Image forming apparatus, motor control apparatus and motor control methodS PRINTING SOLUTION CO LTD·Filed 2013·Granted Apr 24, 2018·0 cites·19 claims
- 4150US9360804B2Image forming apparatus and control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 7, 2016·0 cites·18 claims
- 4249US10203739B2Electronic device for controlling power and method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 12, 2019·0 cites·24 claims
- 4346US11817438B2System in package with interconnected modulesINTEL CORP·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
- 4446US11749653B2Multi-die, vertical-wire package-in-package apparatus, and methods of making sameINTEL CORP·Filed 2017·Granted Sep 5, 2023·0 cites·12 claims
- 4546US10497669B2Hybrid die stackingINTEL CORP·Filed 2016·Granted Dec 3, 2019·0 cites·19 claims
- 4646US8226196B2Image forming apparatus, image forming method and computer readable medium recorded with a program executing the image forming methodKIM HYOUNG-IL·Filed 2007·Granted Jul 24, 2012·0 cites·18 claims
- 4745US11948917B2Die over mold stacked semiconductor packageINTEL CORP·Filed 2019·Granted Apr 2, 2024·0 cites·21 claims
- 4845US10120481B2Method and apparatus for handling touch input in a mobile terminalSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Nov 6, 2018·0 cites·10 claims
- 4945US2020233033A1Test probe for wafer-level and panel-level testingINTEL CORP·Filed 2019·Application pending·0 cites
- 5044US10892248B2Multi-stacked die package with flexible interconnectINTEL CORP·Filed 2016·Granted Jan 12, 2021·0 cites·17 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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