Inventor · disambiguated record
Tyler Leuten
Also filed as: LEUTEN TYLER · LEUTEN TYLER CHARLES
14 granted patents·21 citations·filing 2015–2020
86Inventor score
Files withINTEL CORP14
Top patents by PatentIndex Score
14 records- 0194US10032707B2Post-grind die backside power deliveryINTEL CORP·Filed 2016·Granted Jul 24, 2018·12 cites·25 claims
- 0284US10304799B2Land grid array package extensionINTEL CORP·Filed 2016·Granted May 28, 2019·4 cites·15 claims
- 0377US10748873B2Substrates, assembles, and techniques to enable multi-chip flip chip packagesINTEL CORP·Filed 2015·Granted Aug 18, 2020·3 cites·25 claims
- 0467US11399434B2Electronic package and method of forming an electronic packageINTEL CORP·Filed 2018·Granted Jul 26, 2022·1 cites·21 claims
- 0562US11562978B2Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the sameINTEL CORP·Filed 2016·Granted Jan 24, 2023·1 cites·30 claims
- 0662US10910301B2Post-grind die backside power deliveryINTEL CORP·Filed 2019·Granted Feb 2, 2021·0 cites·25 claims
- 0757US10483198B2Post-grind die backside power deliveryINTEL CORP·Filed 2018·Granted Nov 19, 2019·0 cites·20 claims
- 0853US10872880B2Land grid array package extensionINTEL CORP·Filed 2019·Granted Dec 22, 2020·0 cites·14 claims
- 0951US12237300B2Through-substrate void filling for an integrated circuit assemblyINTEL CORP·Filed 2020·Granted Feb 25, 2025·0 cites·20 claims
- 1051US12096566B2Reciprocal PCB manufacturing processINTEL CORP·Filed 2018·Granted Sep 17, 2024·0 cites·10 claims
- 1147US11495547B2Fiber reinforced stiffenerINTEL CORP·Filed 2018·Granted Nov 8, 2022·0 cites·19 claims
- 1245US11948917B2Die over mold stacked semiconductor packageINTEL CORP·Filed 2019·Granted Apr 2, 2024·0 cites·21 claims
- 1344US11646253B2Ball interconnect structures for surface mount componentsINTEL CORP·Filed 2018·Granted May 9, 2023·0 cites·20 claims
- 1443US11811182B2Solderless BGA interconnectINTEL CORP·Filed 2018·Granted Nov 7, 2023·0 cites·21 claims
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