Inventor · disambiguated record
Tomoyuki Fujisawa
Also filed as: FUJISAWA TOMOYUKI
15 granted patents·3 pending applications·235 citations·filing 2002–2014
92Inventor score
Files withRENESAS TECH CORP9FUJISAWA TOMOYUKI4ASAHI KASEI CHEMICALS CORP2SAMSUNG ELECTRONICS CO LTD2ASAHI CHEMICAL IND1
Top patents by PatentIndex Score
18 records- 0195US6775185B2Nonvolatile semiconductor memoryRENESAS TECH CORP·Filed 2003·Granted Aug 10, 2004·137 cites·10 claims
- 0289US7742334B2Nonvolatile semiconductor memory device for writing multivalued dataSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jun 22, 2010·21 cites·1 claims
- 0388US7581058B2Non-volatile memory having multiple erase operationsRENESAS TECH CORP·Filed 2007·Granted Aug 25, 2009·16 cites·3 claims
- 0477US7233529B2System for erasing nonvolatile memoryRENESAS TECH CORP·Filed 2004·Granted Jun 19, 2007·20 cites·7 claims
- 0570US7334080B2Nonvolatile memory with independent access capability to associated bufferRENESAS TECH CORP·Filed 2002·Granted Feb 19, 2008·15 cites·60 claims
- 0669US7242611B2Nonvolatile semiconductor memory device for writing multivalued dataRENESAS TECH CORP·Filed 2005·Granted Jul 10, 2007·6 cites·11 claims
- 0768US7012836B2Nonvolatile memory and method of restoring of failure memory cellRENESAS TECH CORP·Filed 2004·Granted Mar 14, 2006·16 cites·10 claims
- 0856US7773426B2Data processing system and nonvolatile memoryRENESAS TECH CORP·Filed 2008·Granted Aug 10, 2010·2 cites·5 claims
- 0952US7518929B2Nonvolatile semiconductor memory device for writing multivalued dataSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 14, 2009·2 cites·3 claims
- 1046US9725587B2Injection molded articleFUJISAWA TOMOYUKI·Filed 2011·Granted Aug 8, 2017·0 cites·8 claims
- 1146US2015247037A1Thermoplastic resin composition and molded article thereofASAHI KASEI CHEMICALS CORP·Filed 2013·Application pending·0 cites
- 1244US9273204B2Uncoated highly reflective impact-resistant injection-molded article and process for producing sameFUJISAWA TOMOYUKI·Filed 2011·Granted Mar 1, 2016·0 cites·1 claims
- 1344US2015065637A1Resin composition and molded body thereofASAHI KASEI CHEMICALS CORP·Filed 2013·Application pending·0 cites
- 1443US8829104B2Styrene-based resin composition, and resin molded article comprising sameFUJISAWA TOMOYUKI·Filed 2011·Granted Sep 9, 2014·0 cites·7 claims
- 1542US9758664B2Automotive interior partsASAHI CHEMICAL IND·Filed 2014·Granted Sep 12, 2017·0 cites·5 claims
- 1641US9187626B2Uncoated housing and method for manufacturing sameFUJISAWA TOMOYUKI·Filed 2012·Granted Nov 17, 2015·0 cites·6 claims
- 1741US7391655B2Data processing system and nonvolatile memoryRENESAS TECH CORP·Filed 2007·Granted Jun 24, 2008·0 cites·8 claims
- 1834US2006133126A1Semiconductor memory device capable of switching from multiplex method to non-multiplex methodRENESAS TECH CORP·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →