Inventor · disambiguated record
Hiroyuki Kitabayashi
Also filed as: KITABAYASHI HIROYUKI
29 granted patents·8 pending applications·301 citations·filing 1988–2015
96Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES28KOMATSU MFG CO LTD5KATAYAMA KOJI1KITABAYASHI HIROYUKI1NEC CORP1
Top patents by PatentIndex Score
37 records- 0192US7476909B2Light emitting deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Jan 13, 2009·29 cites·6 claims
- 0289US6320296B1Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2001·Granted Nov 20, 2001·31 cites·2 claims
- 0382US5531087AMetal sheet bending machineKOMATSU MFG CO LTD·Filed 1994·Granted Jul 2, 1996·51 cites·14 claims
- 0481US7423284B2Light emitting device, method for making the same, and nitride semiconductor substrateSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Sep 9, 2008·10 cites·4 claims
- 0577US9384981B2Method of manufacturing silicon carbide semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Jul 5, 2016·2 cites·6 claims
- 0676US5888646ASurface acoustic wave deviceNEC CORP·Filed 1997·Granted Mar 30, 1999·30 cites·9 claims
- 0772US7547910B2Semiconductor light-emitting device and method of manufacturing semiconductor light-emitting deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted Jun 16, 2009·4 cites·6 claims
- 0870US7491974B2Light-emitting deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Feb 17, 2009·4 cites·15 claims
- 0969US6210780B1Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1998·Granted Apr 3, 2001·17 cites·10 claims
- 1069US5367902AMetal sheet bending machineKOMATSU MFG CO LTD·Filed 1991·Granted Nov 29, 1994·19 cites·9 claims
- 1168US5838090ASurface acoustic wave deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Nov 17, 1998·21 cites·21 claims
- 1268US5777422ADiamond-ZnO surface acoustic wave device having relatively thinner ZnO piezoelectric layerSUMITOMO ELECTRIC INDUSTRIES·Filed 1996·Granted Jul 7, 1998·22 cites·4 claims
- 1362US7560740B2Light-emitting deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Jul 14, 2009·2 cites·7 claims
- 1458US6356006B1Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted Mar 12, 2002·5 cites·3 claims
- 1556US6025636ASurface acoustic wave device incorporating single crystal LiNbO3SUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Feb 15, 2000·14 cites·14 claims
- 1655US2010120231A1Method for manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Application pending·0 cites
- 1754US8916462B2Method for manufacturing semiconductor deviceKITABAYASHI HIROYUKI·Filed 2012·Granted Dec 23, 2014·1 cites·17 claims
- 1849US2011012160A1Semiconductor light-emitting device and method for manufacturing semiconductor light-emitting deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Application pending·0 cites
- 1948US8227279B2Manufacturing method of a semiconductor elementKATAYAMA KOJI·Filed 2009·Granted Jul 24, 2012·0 cites·18 claims
- 2048US5814918ADiamond-ZnO surface acoustic wave deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1996·Granted Sep 29, 1998·10 cites·10 claims
- 2147US2011129997A1Method for manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2011·Application pending·0 cites
- 2245US9646834B2Method for manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Granted May 9, 2017·0 cites·14 claims
- 2345US9543154B2Method for manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Granted Jan 10, 2017·0 cites·16 claims
- 2445US9449823B2Method for manufacturing silicon carbide semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Granted Sep 20, 2016·0 cites·10 claims
- 2543US5959389ADiamond-ZnO surface acoustic wave deviceSUMITOMO ELECTRONIC IND LTD·Filed 1997·Granted Sep 28, 1999·8 cites·25 claims
- 2643US5178497AElectrodeposited reamer toolKOMATSU MFG CO LTD·Filed 1989·Granted Jan 12, 1993·9 cites·7 claims
- 2742US2011049542A1AlxGa(1-x)As Substrate, Epitaxial Wafer for Infrared LEDs, Infrared LED, Method of Manufacturing AlxGa(1-x)As Substrate, Method of Manufacturing Epitaxial Wafer for Infrared LEDs, and Method of Manufacturing Infrared LEDsSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Application pending·0 cites
- 2842US2011062466A1AlxGa(1-x)As Substrate, Epitaxial Wafer for Infrared LEDs, Infrared LED, Method of Manufacturing AlxGa(1-x)As Substrate, Method of Manufacturing Epitaxial Wafer for Infrared LEDs, and Method of Manufacturing Infrared LEDsSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Application pending·0 cites
- 2942US2011042706A1AlxGa(1-x)As Substrate, Epitaxial Wafer for Infrared LEDs, Infrared LED, Method of Manufacturing AlxGa(1-x)As Substrate, Method of Manufacturing Epitaxial Wafer for Infrared LEDs, and Method of Manufacturing Infrared LEDsSUMITOMO ELECTRIC INDUSTRIES·Filed 2009·Application pending·0 cites
- 3041US2005110032A1Light-Emitting Diode and Semiconductor Light-Emitting DeviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Application pending·0 cites
- 3140US10056247B2Method of manufacturing silicon carbide semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Aug 21, 2018·0 cites·7 claims
- 3240US9330916B2Method of manufacturing silicon carbide semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted May 3, 2016·0 cites·22 claims
- 3340US9331164B2Silicon carbide semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted May 3, 2016·0 cites·3 claims
- 3440US2013017671A1Method for manufacturing semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2012·Application pending·0 cites
- 3538US5243811AGrinder and method of manufacturing the sameKOMATSU MFG CO LTD·Filed 1991·Granted Sep 14, 1993·9 cites·14 claims
- 3632US5783896ADiamond-Zn0 surface acoustic wave deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Jul 21, 1998·2 cites·55 claims
- 3729US5151109AGrinder and method of manufacturing the sameKOMATSU MFG CO LTD·Filed 1988·Granted Sep 29, 1992·1 cites·15 claims
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