Inventor · disambiguated record
Takahiko Yokai
Also filed as: YOKAI TAKAHIKO
9 granted patents·1 pending application·45 citations·filing 2007–2010
84Inventor score
Top patents by PatentIndex Score
10 records- 0188US8030576B2Wired circuit board with interposed metal thin film and producing method thereofNITTO DENKO CORP·Filed 2008·Granted Oct 4, 2011·18 cites·4 claims
- 0281US8760815B2Wired circuit boardISHII JUN·Filed 2008·Granted Jun 24, 2014·10 cites·3 claims
- 0381US7872200B2Wired circuit board and connection structure between wired circuit boardsNITTO DENKO CORP·Filed 2007·Granted Jan 18, 2011·9 cites·7 claims
- 0478US8647517B2Producing method of suspension board with circuitYOKAI TAKAHIKO·Filed 2008·Granted Feb 11, 2014·4 cites·13 claims
- 0564US8354597B2Wired circuit board and producing method thererofNITTO DENKO CORP·Filed 2008·Granted Jan 15, 2013·2 cites·6 claims
- 0659US8105644B2Manufacturing method of printed circuit boardYOKAI TAKAHIKO·Filed 2008·Granted Jan 31, 2012·2 cites·3 claims
- 0752US7851013B2Underlay substrate, screen printing method and manufacturing method of printed circuit substrateNITTO DENKO CORP·Filed 2008·Granted Dec 14, 2010·0 cites·2 claims
- 0850US8179691B2Wired circuit boardYOKAI TAKAHIKO·Filed 2009·Granted May 15, 2012·0 cites·5 claims
- 0950US7908965B2Underlay substrate for printing a printed circuit on a substrateNITTO DENKO CORP·Filed 2010·Granted Mar 22, 2011·0 cites·4 claims
- 1047US2008047739A1Wired circuit boardNITTO DENKO CORP·Filed 2007·Application pending·0 cites
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