Inventor · disambiguated record
Jeffrey S. Zimmerman
Also filed as: ZIMMERMAN JEFFREY S · ZIMMERMAN JEFFREY SCOTT
18 granted patents·4 pending applications·229 citations·filing 1995–2015
93Inventor score
Top patents by PatentIndex Score
22 records- 0191US7716992B2Sensor, method, and design structure for a low-k delamination sensorIBM·Filed 2008·Granted May 18, 2010·16 cites·19 claims
- 0290US6226976B1Variable fuel heating value adaptive control for gas turbine enginesALLIED SIGNAL INC·Filed 1999·Granted May 8, 2001·105 cites·19 claims
- 0384US7560345B2Method of assessing potential for charging damage in integrated circuit designs and structures for preventing charging damageIBM·Filed 2007·Granted Jul 14, 2009·11 cites·8 claims
- 0483US6949796B1Halo implant in semiconductor structuresIBM·Filed 2004·Granted Sep 27, 2005·28 cites·20 claims
- 0580US7712057B2Determining allowance antenna area as function of total gate insulator area for SOI technologyIBM·Filed 2007·Granted May 4, 2010·11 cites·5 claims
- 0677US10101388B2Method for enhanced semiconductor product diagnostic fail signature detectionIBM·Filed 2015·Granted Oct 16, 2018·2 cites·19 claims
- 0769US7649262B2Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processingIBM·Filed 2009·Granted Jan 19, 2010·2 cites·6 claims
- 0867US7958477B2Structure, failure analysis tool and method of determining white bump location using failure analysis toolIBM·Filed 2008·Granted Jun 7, 2011·3 cites·19 claims
- 0967US6097207ARobust domino circuit design for high stress conditionsIBM·Filed 1998·Granted Aug 1, 2000·20 cites·13 claims
- 1064US6937965B1Statistical guardband methodologyIBM·Filed 2000·Granted Aug 30, 2005·16 cites·6 claims
- 1153US8114767B2Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereofDAUBENSPECK TIMOTHY H·Filed 2008·Granted Feb 14, 2012·0 cites·8 claims
- 1249US9000585B2Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereofDAUBENSPECK TIMOTHY H·Filed 2012·Granted Apr 7, 2015·0 cites·15 claims
- 1348US2013161822A1Controlling density of particles within underfill surrounding solder bump contactsIBM·Filed 2013·Application pending·0 cites
- 1445US7572650B2Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processingINTERNAT BUSINESS MACHNINES CO·Filed 2006·Granted Aug 11, 2009·0 cites·8 claims
- 1544US7232695B2Method and apparatus for completely covering a wafer with a passivating materialIBM·Filed 2005·Granted Jun 19, 2007·0 cites·20 claims
- 1643US2009094567A1Immunity to charging damage in silicon-on-insulator devicesENG CHUNG-PING·Filed 2007·Application pending·0 cites
- 1743US2007271540A1Structure and method for reducing susceptibility to charging damage in soi designsIBM·Filed 2006·Application pending·0 cites
- 1843US2012168956A1Controlling density of particles within underfill surrounding solder bump contactsBARBEAU STEPHANE S·Filed 2011·Application pending·0 cites
- 1942US7173338B2Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processingIBM·Filed 2004·Granted Feb 6, 2007·0 cites·10 claims
- 2041US8990478B2Protection of one-time programmable (OTP) memoryFIFIELD JOHN A·Filed 2012·Granted Mar 24, 2015·0 cites·14 claims
- 2137US5633605ADynamic bus with singular central prechargeIBM·Filed 1995·Granted May 27, 1997·10 cites·11 claims
- 2235US5625631APass through mode for multi-chip-module dieIBM·Filed 1996·Granted Apr 29, 1997·5 cites·11 claims
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