Inventor · disambiguated record
Thomas L. Mcdevitt
Also filed as: MCDEVITT THOMAS L · MCDEVITT THOMAS LEDDY
60 granted patents·9 pending applications·1,278 citations·filing 1993–2015
99Inventor score
Top patents by PatentIndex Score
69 records- 0198US6187680B1Method/structure for creating aluminum wirebound pad on copper BEOLIBM·Filed 1998·Granted Feb 13, 2001·353 cites·19 claims
- 0296US7335577B2Crack stop for low K dielectricsIBM·Filed 2005·Granted Feb 26, 2008·47 cites·9 claims
- 0395US8791778B2Vertical integrated circuit switches, design structure and methods of fabricating sameIBM·Filed 2013·Granted Jul 29, 2014·14 cites·9 claims
- 0495US8604618B2Structure and method for reducing vertical crack propagationCOONEY III EDWARD C·Filed 2011·Granted Dec 10, 2013·24 cites·21 claims
- 0593US8604898B2Vertical integrated circuit switches, design structure and methods of fabricating sameANDERSON FELIX P·Filed 2009·Granted Dec 10, 2013·23 cites·19 claims
- 0693US7521336B2Crack stop for low K dielectricsIBM·Filed 2007·Granted Apr 21, 2009·22 cites·6 claims
- 0793US6436814B1Interconnection structure and method for fabricating sameIBM·Filed 2000·Granted Aug 20, 2002·71 cites·17 claims
- 0892US7538006B1Annular damascene vertical natural capacitorIBM·Filed 2008·Granted May 26, 2009·18 cites·1 claims
- 0991US7015150B2Exposed pore sealing post patterningIBM·Filed 2004·Granted Mar 21, 2006·42 cites·18 claims
- 1091US5930655AFluorine barrier layer between conductor and insulator for degradation preventionIBM·Filed 1997·Granted Jul 27, 1999·87 cites·2 claims
- 1189US6066577AMethod for providing fluorine barrier layer between conductor and insulator for degradation preventionIBM·Filed 1997·Granted May 23, 2000·76 cites·18 claims
- 1288US6310300B1Fluorine-free barrier layer between conductor and insulator for degradation preventionIBM·Filed 1996·Granted Oct 30, 2001·75 cites·19 claims
- 1387US6333559B1Method/structure for creating aluminum wirebound pad on copper BEOLIBM·Filed 2000·Granted Dec 25, 2001·41 cites·15 claims
- 1487US6214730B1Fluorine barrier layer between conductor and insulator for degradation preventionIBM·Filed 1999·Granted Apr 10, 2001·62 cites·3 claims
- 1586US8921975B2System and method for forming aluminum fuse for compatibility with copper BEOL interconnect schemeANDERSON FELIX P·Filed 2012·Granted Dec 30, 2014·8 cites·6 claims
- 1684US6667533B2Triple damascene fuseIBM·Filed 2002·Granted Dec 23, 2003·31 cites·30 claims
- 1782US8575022B2Top corner rounding of damascene wire for insulator crack suppressionCHRISMAN GREGORY S·Filed 2011·Granted Nov 5, 2013·9 cites·22 claims
- 1881US8569091B2Integrated circuit switches, design structure and methods of fabricating the sameANDERSON FELIX P·Filed 2009·Granted Oct 29, 2013·6 cites·9 claims
- 1980US8535966B2Horizontal coplanar switches and methods of manufactureANDERSON FELIX P·Filed 2010·Granted Sep 17, 2013·3 cites·18 claims
- 2079US7709905B2Dual damascene wiring and methodIBM·Filed 2007·Granted May 4, 2010·7 cites·21 claims
- 2179US7541679B2Exposed pore sealing post patterningIBM·Filed 2005·Granted Jun 2, 2009·5 cites·20 claims
- 2278US6833720B1Electrical detection of dicing damageIBM·Filed 2003·Granted Dec 21, 2004·24 cites·20 claims
- 2377US7375039B2Local plasma processingIBM·Filed 2005·Granted May 20, 2008·3 cites·4 claims
- 2477US6518643B2Tri-layer dielectric fuse cap for laser deletionIBM·Filed 2001·Granted Feb 11, 2003·23 cites·15 claims
- 2575US8106513B2Copper damascene and dual damascene interconnect wiringGAMBINO JEFFREY P·Filed 2009·Granted Jan 31, 2012·5 cites·17 claims
- 2673US5401675AMethod of depositing conductors in high aspect ratio apertures using a collimatorFiled 1993·Granted Mar 28, 1995·49 cites·12 claims
- 2772US8026606B2Interconnect layers without electromigrationIBM·Filed 2009·Granted Sep 27, 2011·4 cites·11 claims
- 2872US7585758B2Interconnect layers without electromigrationIBM·Filed 2006·Granted Sep 8, 2009·4 cites·8 claims
- 2972US7176119B2Method of fabricating copper damascene and dual damascene interconnect wiringIBM·Filed 2004·Granted Feb 13, 2007·13 cites·25 claims
- 3071US8586466B2Electrical fuse with a current shuntLEE TOM C·Filed 2010·Granted Nov 19, 2013·4 cites·11 claims
- 3170US7183656B2Bilayer aluminum last metal for interconnects and wirebond padsIBM·Filed 2005·Granted Feb 27, 2007·4 cites·20 claims
- 3269US7678683B2Method of fabricating copper damascene and dual damascene interconnect wiringIBM·Filed 2006·Granted Mar 16, 2010·3 cites·33 claims
- 3369US7649262B2Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processingIBM·Filed 2009·Granted Jan 19, 2010·2 cites·6 claims
- 3468US6504203B2Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formedIBM·Filed 2001·Granted Jan 7, 2003·12 cites·16 claims
- 3567US8137791B2Fuse and pad stress reliefANDERSON FELIX PATRICK·Filed 2007·Granted Mar 20, 2012·4 cites·18 claims
- 3665US9275951B2Curvilinear wiring structure to reduce areas of high field density in an integrated circuitGLOBALFOUNDRIES INC·Filed 2013·Granted Mar 1, 2016·1 cites·6 claims
- 3764US8088690B2CMP methodMCDEVITT THOMAS L·Filed 2009·Granted Jan 3, 2012·3 cites·9 claims
- 3862US8927411B2System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect schemeIBM·Filed 2013·Granted Jan 6, 2015·1 cites·5 claims
- 3962US7879716B2Metal seed layer depositionIBM·Filed 2007·Granted Feb 1, 2011·2 cites·18 claims
- 4061US6653737B2Interconnection structure and method for fabricating sameIBM·Filed 2002·Granted Nov 25, 2003·8 cites·14 claims
- 4160US8637403B2Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectricsAMOAH YOBA·Filed 2011·Granted Jan 28, 2014·1 cites·20 claims
- 4260US8293634B2Structures and methods for improving solder bump connections in semiconductor devicesANDERSON FELIX P·Filed 2008·Granted Oct 23, 2012·1 cites·14 claims
- 4359US8530970B2Curvilinear wiring structure to reduce areas of high field density in an integrated circuitANDERSON FELIX PATRICK·Filed 2009·Granted Sep 10, 2013·1 cites·8 claims
- 4459US2008146040A1Local plasma processingGAMBINO JEFFREY P·Filed 2008·Application pending·0 cites
- 4558US5494860ATwo step annealing process for decreasing contact resistanceIBM·Filed 1995·Granted Feb 27, 1996·29 cites·18 claims
- 4655US8878315B2Horizontal coplanar switches and methods of manufactureIBM·Filed 2013·Granted Nov 4, 2014·0 cites·11 claims
- 4755US7223684B2Dual damascene wiring and methodIBM·Filed 2004·Granted May 29, 2007·5 cites·20 claims
- 4855US6784516B1Insulative cap for laser fusingIBM·Filed 2000·Granted Aug 31, 2004·5 cites·10 claims
- 4955US6762108B2Method of forming a metal-insulator-metal capacitor for dual damascene interconnect processing and the device so formedIBM·Filed 2002·Granted Jul 13, 2004·5 cites·13 claims
- 5055US5486267AMethod for applying photoresistIBM·Filed 1994·Granted Jan 23, 1996·24 cites·11 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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