Inventor · disambiguated record
Jeremy E. Minnich
Also filed as: MINNICH JEREMY · MINNICH JEREMY E
11 granted patents·5 pending applications·35 citations·filing 2004–2025
86Inventor score
Top patents by PatentIndex Score
16 records- 0192US11594432B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 28, 2023·2 cites·19 claims
- 0290US10090177B1Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 2, 2018·5 cites·10 claims
- 0385US11670612B2Method for solder bridging elimination for bulk solder C2S interconnectsMICRON TECHNOLOGY INC·Filed 2021·Granted Jun 6, 2023·1 cites·14 claims
- 0485US10276539B1Method for 3D ink jet TCB interconnect controlMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 30, 2019·7 cites·18 claims
- 0576US10410891B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·1 cites·16 claims
- 0675US7476955B2Die package having an adhesive flow restriction areaMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 13, 2009·17 cites·14 claims
- 0764US10998208B2Cold fluid semiconductor device release during pick and place operations, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted May 4, 2021·0 cites·17 claims
- 0859US2021111132A1Method for Substrate Moisture NCF Voiding EliminationMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 0958US2024222184A1Semiconductor substrate with a sacrificial annulusMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1055US2025316494A1Techniques for surface modifications during bonding proceduresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1152US10879195B2Method for substrate moisture NCF voiding eliminationMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 29, 2020·0 cites·10 claims
- 1252US10043688B1Method for mount tape die release system for thin die ejectionMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 7, 2018·0 cites·23 claims
- 1350US2019067232A1Method for Solder Bridging Elimination for Bulk Solder C2S InterconnectsMICRON TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 1449US2007114646A1Die package having an adhesive flow restriction areaSTREET BRET K·Filed 2007·Application pending·0 cites
- 1548US7491570B2Die package having an adhesive flow restriction areaMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 17, 2009·2 cites·17 claims
- 1643US10700038B2Methods and systems for inhibiting bonding materials from contaminating a semiconductor processing toolMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 30, 2020·0 cites·25 claims
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