Inventor · disambiguated record
Wen-Chuan Tai
Also filed as: TAI WEN-CHUAN
50 granted patents·11 pending applications·153 citations·filing 2010–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD49TAIWAN SEMICONDUCTOR MFG5SHU CHIA-PAO3CHUNG TIEN-KAN2HUNG CHIA-MING1
Top patents by PatentIndex Score
61 records- 0197US9567204B2Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 14, 2017·18 cites·20 claims
- 0296US8716852B2Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the sameSHU CHIA-PAO·Filed 2012·Granted May 6, 2014·26 cites·20 claims
- 0395US10392244B2Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 27, 2019·9 cites·20 claims
- 0495US9656857B2Microelectromechanical systems (MEMS) devices at different pressuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 23, 2017·13 cites·20 claims
- 0594US12123846B2Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·1 cites·20 claims
- 0692US11747298B2Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 5, 2023·2 cites·20 claims
- 0792US10131540B2Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 20, 2018·9 cites·20 claims
- 0892US9365416B2Structure and method for motion sensorSHU CHIA-PAO·Filed 2012·Granted Jun 14, 2016·12 cites·31 claims
- 0989US10556792B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 11, 2020·3 cites·20 claims
- 1089US9266714B2Micro-electro mechanical system (MEMS) structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·6 cites·20 claims
- 1189US2025122071A1Piezoelectric anti-stiction structure for microelectromechanical systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1288US12015001B2Bonding structure and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 18, 2024·1 cites·20 claims
- 1387US10961118B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·2 cites·20 claims
- 1487US9845236B2Monolithic MEMS platform for integrated pressure, temperature, and gas sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 19, 2017·4 cites·20 claims
- 1587US8878312B2Electrical bypass structure for MEMS deviceHUNG CHIA-MING·Filed 2011·Granted Nov 4, 2014·16 cites·15 claims
- 1686US12215016B2Piezoelectric anti-stiction structure for microelectromechanical systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 1786US9630832B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 25, 2017·6 cites·20 claims
- 1885US9202792B2Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)TAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 1, 2015·7 cites·18 claims
- 1985US8928162B2Sensor with energy-harvesting deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 6, 2015·4 cites·20 claims
- 2084US12123871B2Biosensor system with integrated microneedleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 22, 2024·1 cites·20 claims
- 2182US2025312823A1Transducer device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2282US2025333295A1Micro-electromechanical systems (mems) device with outgas layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2381US11834325B2Piezoelectric anti-stiction structure for microelectromechanical systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 2480US2025035623A1Biosensor system with integrated microneedleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2579US12392774B2Biosensor system with integrated microneedleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 2679US2024375943A1Dielectric protection layer configured to increase performance of mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2779US2024410855A1Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2877US11667522B2MEMS package comprising multi-depth trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·20 claims
- 2977US10266396B2MEMS device with enhanced sensing structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 3076US10865102B2Multi-depth MEMS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·0 cites·20 claims
- 3176US9856139B2Microelectromechanical systems (MEMS) devices at different pressuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 2, 2018·1 cites·20 claims
- 3274US10266399B2Apparatus and method of manufacturing for combo MEMS device accommodating different working pressuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·1 cites·20 claims
- 3374US2024304580A1Bonding structure and method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3473US9776858B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 3, 2017·2 cites·20 claims
- 3572US10752495B2Method for forming multi-depth MEMS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·0 cites·20 claims
- 3672US2023381815A1Transducer device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3771US12269735B2Dielectric protection layer configured to increase performance of mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 3871US10464808B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 3971US9422151B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·1 cites·20 claims
- 4071US2025316540A1Method and system for detecting semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4170US12441604B2Micro-electromechanical systems (MEMS) device with outgas layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 4270US11365115B2Piezoelectric anti-stiction structure for microelectromechanical systemsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 21, 2022·0 cites·20 claims
- 4369US10899608B2Wafer level integrated MEMS device enabled by silicon pillar and smart capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 26, 2021·0 cites·20 claims
- 4468US8723280B2Hybrid MEMS bump design to prevent in-process and in-use stictionSHU CHIA-PAO·Filed 2012·Granted May 13, 2014·2 cites·20 claims
- 4567US12362240B2Method and system for detecting semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 4665US12479719B2MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 4765US10556790B2Method for forming multi-depth MEMS packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 11, 2020·0 cites·20 claims
- 4865US8723343B2Sensor with energy-harvesting deviceCHUNG TIEN-KAN·Filed 2011·Granted May 13, 2014·1 cites·20 claims
- 4963US10981781B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 5062US9584003B2Energy-harvesting deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 28, 2017·0 cites·20 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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