Inventor · disambiguated record
Kwi-Jong Lee
Also filed as: LEE KWI JONG
24 granted patents·27 pending applications·152 citations·filing 2004–2020
95Inventor score
Top patents by PatentIndex Score
51 records- 0197US7559970B2Method for producing metal nanoparticles and metal nanoparticles produced therebySAMSUNG ELECTRO MECH·Filed 2007·Granted Jul 14, 2009·47 cites·11 claims
- 0292US7591872B1Method for producing silver nanoparticles and conductive inkSAMSUNG ELECTRO MECH·Filed 2006·Granted Sep 22, 2009·13 cites·11 claims
- 0388US7744834B2Method for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Granted Jun 29, 2010·13 cites·17 claims
- 0488US7505247B2Multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 17, 2009·16 cites·7 claims
- 0586US7593214B2Array type multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Sep 22, 2009·13 cites·12 claims
- 0685US8388725B2Apparatus and method for manufacturing metal nanoparticlesLEE YOUNG-IL·Filed 2010·Granted Mar 5, 2013·5 cites·7 claims
- 0779US7931730B2Method for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Granted Apr 26, 2011·5 cites·14 claims
- 0875US7881039B2Multi-layer ceramic capacitor having improved component capacity and production method thereofSAMSUNG ELECTRO MECH·Filed 2009·Granted Feb 1, 2011·6 cites·7 claims
- 0974US7648654B2Nonaqueous conductive nanoink compositionSAMSUNG ELECTRO MECH·Filed 2008·Granted Jan 19, 2010·5 cites·4 claims
- 1070US7671514B2Electroactive solid-state actuator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 2, 2010·10 cites·7 claims
- 1167US7593215B2Multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2006·Granted Sep 22, 2009·3 cites·14 claims
- 1262US8004822B2Multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2009·Granted Aug 23, 2011·1 cites·5 claims
- 1361US7867316B2Method of manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Granted Jan 11, 2011·6 cites·12 claims
- 1460US11688546B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Jun 27, 2023·0 cites·14 claims
- 1560US9090635B2Copper organic metal, method for preparing copper organic metal and copper pasteSAMSUNG ELECTRO MECH·Filed 2012·Granted Jul 28, 2015·0 cites·2 claims
- 1660US2010078604A1Nickel nanoparticlesSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1757US8158031B2Method for preparing metal nanoparticles using metal seed and metal nanoparticles comprising metal seedLEE KWI-JONG·Filed 2009·Granted Apr 17, 2012·3 cites·6 claims
- 1857US7935169B2Apparatus and method for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Granted May 3, 2011·4 cites·13 claims
- 1956US11721468B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 8, 2023·0 cites·15 claims
- 2056US11211193B2Electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Dec 28, 2021·0 cites·13 claims
- 2156US7648556B2Method for manufacturing nickel nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 19, 2010·0 cites·15 claims
- 2256US2014049874A1Metal powder, electronic component and method of producing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2356US2011267738A1Multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 2453US2016141116A1Metal powder, electronic component and method of producing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2552US8187504B2Copper nanoparticle dispersionLEE YOUNG IL·Filed 2009·Granted May 29, 2012·0 cites·6 claims
- 2652US2014023779A1Conductive copper paste composition and method of forming metal thin film using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2751US2009308645A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2851US2010020466A1Array type multi-layer ceramic capacitor and production method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2951US2015284412A1Method for preparing copper organic metal and copper pasteSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3050US2010031848A1Alloy nanoparticles of sn-cu-ag, preparation method thereof and ink or paste using the alloy nanoparticlesSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3150US2006203423A1Multi-layer ceramic capacitor and production method thereofLEE KWI-JONG·Filed 2006·Application pending·0 cites
- 3249US8496873B2Alloy nanoparticles of SN-CU-AG, preparation method thereof and ink or paste using the alloy nanoparticlesLEE KWI-JONG·Filed 2012·Granted Jul 30, 2013·0 cites·11 claims
- 3349US2009110619A1Apparatus for manufacturing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3448US2007190323A1Method of producing metal nanoparticlesSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3548US2008138643A1Method for manufacturing copper nanoparticles and copper nanoparticles manufactured using the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3648US2015028983A1Chip electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3748US2009025510A1Method for manufacturing nickel nanoparticlesSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3848US2011236646A1Ink composition, metal thin film prepared using the same and method of preparing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 3948US2008282537A1Wiring forming method of printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4047US2007275259A1Method of producing metal nanoparticles and metal nanoparticles produced therebySAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 4147US2011129607A1Substitutional electroless gold plating solution and method for forming gold plating layer using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4246US2006254387A1Metal nano particle and method for manufacturing them and conductive inkSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4345US2013164553A1Copper powder, copper paste and method for preparing copper powderSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 4445US2006261316A1Conductive ink, preparation method thereof and conductive boardSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 4544US8173210B2Methods for surface modification of non-dispersible metal nanoparticles and modified metal nanoparticles for inkjet by the same methodSHIM IN-KEUN·Filed 2007·Granted May 8, 2012·0 cites·17 claims
- 4644US2013280158A1Method of producing copper precursor and copper precursor produced by using the sameKWON JI HAN·Filed 2012·Application pending·0 cites
- 4742US7276091B2Method of producing polymer capacitor by forming micropore in ion exchange membrane and polymer capacitor produced therebySAMSUNG ELECTRO MECH·Filed 2004·Granted Oct 2, 2007·2 cites·11 claims
- 4841US2006213603A1Multi-layer ceramic electronic component and production method thereofLEE KWI-JONG·Filed 2006·Application pending·0 cites
- 4938US2016189874A1Electrode structure for capacitor, electrolytic capacitor, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 5037US2011151117A1Organic metal complexes for forming metal thin layer, ink including the same and method for forming metal thin layer using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
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