Inventor · disambiguated record
Katsufumi Hiraishi
Also filed as: HIRAISHI KATSUFUMI
6 granted patents·4 pending applications·35 citations·filing 2000–2019
80Inventor score
Files withNIPPON STEEL & SUMIKIN CHEM CO4NIPPON STEEL CHEMICAL CO2AOYAGI EIJIRO1HIRAISHI KATSUFUMI1NIPPON STEEL CHEMICAL & MAT CO LTD1
Top patents by PatentIndex Score
10 records- 0188US9868823B2Display device, method for manufacturing same, polyimide film for display device supporting bases, and method for producing polyimide film for display device supporting basesNIPPON STEEL & SUMIKIN CHEM CO·Filed 2017·Granted Jan 16, 2018·2 cites·11 claims
- 0288US9403947B2Display device, method for manufacturing same, polyimide film for display device supporting bases, and method for producing polyimide film for display device supporting basesNIPPON STEEL & SUMIKIN CHEM CO·Filed 2013·Granted Aug 2, 2016·8 cites·5 claims
- 0383US9695283B2Display device, method for manufacturing same, polyimide film for display device supporting bases, and method for producing polyimide film for display device supporting basesNIPPON STEEL & SUMIKIN CHEM CO·Filed 2016·Granted Jul 4, 2017·4 cites·6 claims
- 0466US6998455B1Laminate and process for producing the sameNIPPON STEEL CHEMICAL CO·Filed 2000·Granted Feb 14, 2006·17 cites·11 claims
- 0556US2015136209A1Polyimide layer-containing flexible substrate, polyimide layer-containing substrate for flexible solar cell, flexible solar cell, and method for producing sameNIPPON STEEL & SUMIKIN CHEM CO·Filed 2013·Application pending·0 cites
- 0652US9101062B2Highly heat conductive polyimide film, highly heat conductive metal-clad laminate, and method for producing the sameAOYAGI EIJIRO·Filed 2009·Granted Aug 4, 2015·2 cites·4 claims
- 0751US2021340325A1Polyimide precursor, polyimide produced from same, and flexible deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2019·Application pending·0 cites
- 0838US7070864B2Laminate for electronic materialsNIPPON STEEL CHEMICAL CO·Filed 2002·Granted Jul 4, 2006·2 cites·7 claims
- 0936US2004038054A1Laminate for substrate of printed wiring boardFiled 2003·Application pending·0 cites
- 1036US2006151106A1Method for producing laminateHIRAISHI KATSUFUMI·Filed 2004·Application pending·0 cites
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