Inventor · disambiguated record
Jui-Yu Chuang
Also filed as: CHUANG JUI-YU
10 granted patents·413 citations·filing 2000–2004
92Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0195US6483178B1Semiconductor device package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Nov 19, 2002·135 cites·20 claims
- 0290USD529031SIC card type circuit moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 26, 2006·41 cites·1 claims
- 0390US6472743B2Semiconductor package with heat dissipating structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 29, 2002·74 cites·15 claims
- 0485US6847104B2Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jan 25, 2005·42 cites·17 claims
- 0581US6781222B2Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 24, 2004·34 cites·20 claims
- 0681US6673690B2Method of mounting a passive component over an integrated circuit package substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jan 6, 2004·32 cites·4 claims
- 0779USD492314SIC card type circuit moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jun 29, 2004·24 cites·1 claims
- 0869US6538321B2Heat sink with collapse structure and semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Mar 25, 2003·14 cites·10 claims
- 0960US7339280B2Semiconductor package with lead frame as chip carrier and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Mar 4, 2008·10 cites·13 claims
- 1058US6858931B2Heat sink with collapse structure for semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Feb 22, 2005·7 cites·6 claims
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