Inventor · disambiguated record
Fen F. Jamin
Also filed as: JAMIN FEN F · JAMIN FEN FEN
16 granted patents·1 pending application·363 citations·filing 1998–2005
94Inventor score
Files withIBM12INFINEON TECHNOLOGIES CORP2ADVANCED MICRO DEVICES INC1INFINEON TECHNOLOGIES NORHT AM1SIEMENS AG1
Top patents by PatentIndex Score
17 records- 0195US6975032B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2002·Granted Dec 13, 2005·85 cites·19 claims
- 0292US7064064B2Copper recess process with application to selective capping and electroless platingIBM·Filed 2005·Granted Jun 20, 2006·22 cites·10 claims
- 0390US6498383B2Oxynitride shallow trench isolation and method of formationIBM·Filed 2001·Granted Dec 24, 2002·49 cites·10 claims
- 0485US6264789B1System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor waferINFINEON TECHNOLOGIES CORP·Filed 2000·Granted Jul 24, 2001·33 cites·22 claims
- 0580US6764922B2Method of formation of an oxynitride shallow trench isolationIBM·Filed 2003·Granted Jul 20, 2004·22 cites·13 claims
- 0678US6780695B1BiCMOS integration scheme with raised extrinsic baseIBM·Filed 2003·Granted Aug 24, 2004·24 cites·17 claims
- 0773US6709951B2Oxynitride shallow trench isolation and method of formationIBM·Filed 2002·Granted Mar 23, 2004·15 cites·9 claims
- 0869US6171513B1Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrierIBM·Filed 1999·Granted Jan 9, 2001·30 cites·20 claims
- 0963US6225224B1System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor waferINFINEON TECHNOLOGIES NORHT AM·Filed 1999·Granted May 1, 2001·28 cites·19 claims
- 1059US7041600B2Methods of planarizationIBM·Filed 2003·Granted May 9, 2006·6 cites·14 claims
- 1159US6149830AComposition and method for reducing dishing in patterned metal during CMP processSIEMENS AG·Filed 1998·Granted Nov 21, 2000·26 cites·6 claims
- 1253US6368969B1Chemical-mechanical polishing methodsIBM·Filed 2000·Granted Apr 9, 2002·4 cites·17 claims
- 1352US6344414B1Chemical-mechanical polishing system having a bi-material wafer backing film assemblyIBM·Filed 1999·Granted Feb 5, 2002·15 cites·20 claims
- 1448US6365328B1Semiconductor structure and manufacturing methodINFINEON TECHNOLOGIES CORP·Filed 2000·Granted Apr 2, 2002·3 cites·7 claims
- 1541US7040966B2Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafersIBM·Filed 2004·Granted May 9, 2006·1 cites·20 claims
- 1637US2005221612A1A low thermal budget (mol) liner, a semiconductor device comprising said liner and method of forming said semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2004·Application pending·0 cites
- 1735US7214623B2Planarization system and method using a carbonate containing fluidIBM·Filed 2003·Granted May 8, 2007·0 cites·23 claims
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