Inventor · disambiguated record
An-Hsuan Lee
Also filed as: LEE AN-HSUAN
12 granted patents·5 pending applications·5 citations·filing 2019–2025
84Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD17
Top patents by PatentIndex Score
17 records- 0189US11752592B2Slurry enhancement for polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·1 cites·20 claims
- 0289US11495471B2Slurry compositions for chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
- 0389US11267987B2Chemical mechanical polishing slurry composition and method of polishing metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·2 cites·20 claims
- 0484US12441912B2Chemical mechanical polishing slurry composition and method of polishing metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 0582US2023356356A1Slurry enhancement for polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0681US12176217B2Method for manufacturing a semiconductor using slurryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0779US12269141B2Fabrication of a polishing pad for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 0877US2025235979A1Fabrication of a polishing pad for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0976US12024651B2Chemical mechanical polishing slurry composition and method of polishing metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1076US2025218792A1Slurry compositions for chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1175US12261055B2Slurry compositions for chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 1275US11697183B2Fabrication of a polishing pad for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 11, 2023·0 cites·20 claims
- 1369US11688607B2SlurryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·19 claims
- 1468US11525072B2Materials and methods for chemical mechanical polishing of ruthenium-containing materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 1558US10920105B2Materials and methods for chemical mechanical polishing of ruthenium-containing materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
- 1656US2025014943A1Surface Profile Control Of Passivation Layers In Integrated Circuit ChipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1755US2024112928A1Trimming methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →