Inventor · disambiguated record

Ting-Chou Lin

Also filed as: LIN TING-CHOU

1 granted patent·0 citations·filing 2016–2016

7Inventor score

Technology areasG06F

Files withANAGLOBE TECH INC1

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1 record

0137US9928334B2Redistribution layer routing for integrated fan-out wafer-level chip-scale packagesANAGLOBE TECH INC·Filed 2016·Granted Mar 27, 2018·0 cites·16 claims

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