Inventor · disambiguated record
Seiji Karashima
Also filed as: KARASHIMA SEIJI
42 granted patents·5 pending applications·341 citations·filing 2004–2011
98Inventor score
Files withPANASONIC CORP27MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7KITAE TAKASHI5HIRANO KOICHI2KARASHIMA SEIJI2
Top patents by PatentIndex Score
47 records- 0197US7748110B2Method for producing connection memberPANASONIC CORP·Filed 2007·Granted Jul 6, 2010·50 cites·8 claims
- 0296US7258549B2Connection member and mount assembly and production method of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Aug 21, 2007·61 cites·23 claims
- 0392US7184617B2Portable deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Feb 27, 2007·29 cites·6 claims
- 0491US7537961B2Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the samePANASONIC CORP·Filed 2007·Granted May 26, 2009·18 cites·9 claims
- 0591US7531387B1Flip chip mounting method and bump forming methodPANASONIC CORP·Filed 2006·Granted May 12, 2009·19 cites·29 claims
- 0690US7205483B2Flexible substrate having interlaminar junctions, and process for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 17, 2007·17 cites·20 claims
- 0789US7714444B2Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the samePANASONIC CORP·Filed 2009·Granted May 11, 2010·9 cites·10 claims
- 0888US7799607B2Process for forming bumps and solder bumpPANASONIC CORP·Filed 2005·Granted Sep 21, 2010·16 cites·21 claims
- 0986US7910403B2Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the samePANASONIC CORP·Filed 2006·Granted Mar 22, 2011·12 cites·10 claims
- 1085US7242823B2Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 10, 2007·12 cites·8 claims
- 1183US7759162B2Flip chip mounting process and flip chip assemblyPANASONIC CORP·Filed 2005·Granted Jul 20, 2010·10 cites·3 claims
- 1281US8283246B2Flip chip mounting method and bump forming methodKITAE TAKASHI·Filed 2011·Granted Oct 9, 2012·4 cites·7 claims
- 1381US7689129B2System-in-package optical transceiver in optical communication with a plurality of other system-in-package optical transceivers via an optical transmission linePANASONIC CORP·Filed 2005·Granted Mar 30, 2010·11 cites·5 claims
- 1478US7531754B2Flexible substrate having interlaminar junctions, and process for producing the samePANASONIC CORP·Filed 2007·Granted May 12, 2009·6 cites·11 claims
- 1578US7531385B1Flip chip mounting method and method for connecting substratesPANASONIC CORP·Filed 2006·Granted May 12, 2009·7 cites·17 claims
- 1676US7951700B2Flip chip mounting method and bump forming methodPANASONIC CORP·Filed 2006·Granted May 31, 2011·5 cites·9 claims
- 1776US7726545B2Flip chip mounting process and bump-forming process using electrically-conductive particles as nucleiPANASONIC CORP·Filed 2006·Granted Jun 1, 2010·8 cites·9 claims
- 1872US7919357B2Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substratesPANASONIC CORP·Filed 2009·Granted Apr 5, 2011·5 cites·12 claims
- 1971US8501583B2Method for connecting between substrates, flip-chip mounting structure, and connection structure between substratesKITAE TAKASHI·Filed 2009·Granted Aug 6, 2013·5 cites·11 claims
- 2069US7911064B2Mounted body and method for manufacturing the samePANASONIC CORP·Filed 2006·Granted Mar 22, 2011·4 cites·13 claims
- 2169US7875496B2Flip chip mounting method, flip chip mounting apparatus and flip chip mounting bodyPANASONIC CORP·Filed 2006·Granted Jan 25, 2011·5 cites·12 claims
- 2267US7638883B2Flip chip mounting method and bump forming methodPANASONIC CORP·Filed 2008·Granted Dec 29, 2009·3 cites·7 claims
- 2366US7921551B2Electronic component mounting methodPANASONIC CORP·Filed 2006·Granted Apr 12, 2011·4 cites·13 claims
- 2465US7927997B2Flip-chip mounting method and bump formation methodPANASONIC CORP·Filed 2006·Granted Apr 19, 2011·3 cites·8 claims
- 2564US7754529B2Flip chip mounting body and method for mounting such flip chip mounting body and bump forming methodPANASONIC CORP·Filed 2006·Granted Jul 13, 2010·2 cites·14 claims
- 2662US8012801B2Flip chip mounting process and flip chip assemblyPANASONIC CORP·Filed 2010·Granted Sep 6, 2011·1 cites·10 claims
- 2762US7640659B2Method for forming conductive pattern and wiring boardPANASONIC CORP·Filed 2005·Granted Jan 5, 2010·2 cites·18 claims
- 2860US7820021B2Flip chip mounting method and method for connecting substratesPANASONIC CORP·Filed 2008·Granted Oct 26, 2010·1 cites·2 claims
- 2960US7649267B2Package equipped with semiconductor chip and method for producing samePANASONIC CORP·Filed 2006·Granted Jan 19, 2010·2 cites·13 claims
- 3060US7136543B2Mount assembly, optical transmission line and photoelectric circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 14, 2006·4 cites·18 claims
- 3159US9426899B2Electronic component assemblyKITAE TAKASHI·Filed 2008·Granted Aug 23, 2016·1 cites·7 claims
- 3258US8097958B2Flip chip connection structure having powder-like conductive substance and method of producing the sameSAWADA SUSUMU·Filed 2007·Granted Jan 17, 2012·2 cites·33 claims
- 3357US8064213B2Module with a built-in component, and electronic device with the sameASAHI TOSHIYUKI·Filed 2005·Granted Nov 22, 2011·1 cites·23 claims
- 3456US7905011B2Bump forming method and bump forming apparatusPANASONIC CORP·Filed 2007·Granted Mar 15, 2011·1 cites·18 claims
- 3554US8887383B2Electrode structure and method for forming bumpTANIGUCHI YASUSHI·Filed 2007·Granted Nov 18, 2014·1 cites·12 claims
- 3652US2011133137A1Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the sameHIRANO KOICHI·Filed 2011·Application pending·0 cites
- 3749US7732920B2Flip chip mounting body, flip chip mounting method and flip chip mounting apparatusPANASONIC CORP·Filed 2006·Granted Jun 8, 2010·0 cites·6 claims
- 3849US2007224735A1Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 3948US8691683B2Flip-chip mounting method and bump formation methodHIRANO KOICHI·Filed 2011·Granted Apr 8, 2014·0 cites·8 claims
- 4048US7522938B2Portable information terminal apparatusPANASONIC CORP·Filed 2005·Granted Apr 21, 2009·0 cites·10 claims
- 4148US2009008776A1Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing MethodKITAE TAKASHI·Filed 2007·Application pending·0 cites
- 4245US8071425B2Flip chip mounting body, flip chip mounting method and flip chip mounting apparatusNAKATANI SEIICHI·Filed 2010·Granted Dec 6, 2011·0 cites·11 claims
- 4345US7640654B2Electronic component transporting methodPANASONIC CORP·Filed 2007·Granted Jan 5, 2010·0 cites·23 claims
- 4442US2009085227A1Flip-chip mounting body and flip-chip mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 4541US8709293B2Flip-chip mounting resin composition and bump forming resin compositionKITAE TAKASHI·Filed 2005·Granted Apr 29, 2014·0 cites·17 claims
- 4641US8297488B2Bump forming method using self-assembling resin and a wall surfaceKARASHIMA SEIJI·Filed 2007·Granted Oct 30, 2012·0 cites·20 claims
- 4734US2006091524A1Semiconductor module, process for producing the same, and film interposerKARASHIMA SEIJI·Filed 2005·Application pending·0 cites
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